Originally Posted by LoneWolf3574
Just a general curiosity question. So what method do YOU use to apply TIM to your CPU/cooler mating surfaces? This even applies to the WC and phase change coolers. You may even include your GPU, NB, SB, GPU VRM, etc. Whatever has a cooler on it in your computer.
For me, it depends. With a HDT the two/three line method (depends on the number of heatpipes), but for a standard heatsink (flat) I spread it on the CPU. I tend to leave the NB, SB, and GPU related stuff alone at this time.
It depends on what TIM it is and how thick it is. For IC7 I do this:
1. You NEED to run it under hot water for about 2-3 minutes so it is easier to get out of the tube.
2. You cannot spread it, so you have to put a glob in the dead center of your CPU.
I recommend using a 6-7mm glob for people using a HDT cooler like the s1283 and for everyone else, use a 5-6mm glob.
3. Take heat sinks and put it down onto the processor and apply some pressure. Then twist side to side a few times try not to lift the cooler up (air pockets are really bad with IC7).
Optional Step 4. Turn your computer on (the mobo out side of the case with all the essentials plugged in like power, GPU, and the power button) and let it get a warm without the fan on the cooler (if you cannot do this then leave it on but do not plug in the fan) (about 2-3 minutes BUT NO MORE THAN 5 MINUTES!!!!!!!!!!!) then twist side to side 2-3 times (this spreads it even more).
5. Tighten down the heat sink. And put the fan back on the heat sink.
6. Turn your computer on and really stress it hard for 2 hours (Intel Burn Test or OCCT LinPack) to break in the compound since it has a 2 hour cure time.
For TIM like MX-2, AS5, etc, I put a good sized bit in the center of the CPU (5-6mm blob) and spread it with a razor blade.