Originally Posted by B NEGATIVE
Neither,you need to make it wider than the bore of the fitting to keep the flow up,you need to manufacture a sealing channel for the o-ring,you also need to look at the base thickness,mounts and how you are going to mount the top...
Block 2 is the worst out of the 2 there,that center fin has just crippled the flow rate..4mm is less than half of what you need and example 2 has around 2mm bore with that center fin,you need to flatten the bore out so you get the maximum surface area closest the heat source. Example 8mm x 3mm..the 8mm side being closest to the heatsource.
Maybe get a loop together before designing parts,it will get you a better feel for how it all works.
Thanks for your answer
.. I know about the sealing channel etc, but it was just to show it very fast - Thats why i wrote "This is just a fast example, but hope you can see the idea" (Not the best to explain myself in English allways)
This I made a little time ago, and thinks its pretty decent ...
And this will be next when I get some machine time, a new EK top that will fit the Shuttle mountings holes on S775 that is different than normal ...
But you got some great points
... The base thickness will be around 2mm (Was the plan) to keep some strenght, and a short way to transfer heat to the water ..
Will be using 13/10mm tubing with 1/4" thread, so the hole is around 8.X mm if I remember correct - So if the channel is around 8-9mm wide, there will be no problem if its only 5mm high ? (Or should if be 8x8mm to get the best flow)
Hope that you understand, the school English really need some fine tuning againg
- And thanks to all the other answer
Check out "Custom PC UK September 2012" issue. near the end of
all of their issues they have handy little "how to" 's and that issue
they show roughly how to make a motherboard waterblock.
i believe they do utilize a pre-existing universal block but
still worth checking out. it will at least hopefully give you some
Will try go get it, thanks