heh well let me just say this: you have found a customized solution that you are good at applying and works for you. that being said for recommending a method to someone else, especially if new to this, your method is much more likely and almost certainly with a new user to cause an air bubble to form in the center, or it may just be you applied a little more on one side while making the shape then slightly less on the other side causing the coverage to migrate a bit towards the more laden side and possibly down the side onto a pin or two. Same can be said for line applications IMHO.
anyhow, for me personally, i'm more worried about getting good, solid contact in the center of my chip, but pea method too can be goofed(just realized mine was less than great when I put on the ICD7).
Now getting temp of 12c from coretemp at semi-idle.