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post #16941 of 28351
Quote:
Originally Posted by liquidmetal17 View Post
@thrasherht

I changed the MoBo in my build to the ASUS P8P67 (REV 3.0). It seems to have all of the features I'm looking for in a MoBo. Out of curiosity, why do you recommend only those two brands? I'm pretty new to making 'serious' machines and am always looking to learn something new. Thanks again for your help.

@Ceadderman

Thank you for confirming the information about the P67 North Bridge. I was able to find an ASUS board that stated it supported SATA 3 RAID0. As far as the fans go, I intend to get as much life out of this rig as I can before I have to buy a new one so I figure that I'll end up overclocking it eventually. I'm pretty sure that having a fan controller in the build will enable me to keep the machine quiet when I'm just web browsing or whatever. When I'm gaming with my headset on I don't mind having them running full blast.

One other thing that I forgot to ask about. Regarding lapping the CPU, does that really make a huge difference? Aside from voiding the warranty, are there any drawbacks to lapping it?
This is why I recommend those brands.
I would recommend DFI but they don't make consumer boards anymore.
http://www.overclock.net/amd-cpus/94...hy-choose.html
post #16942 of 28351
@Ceadderman

I know how to tell if a CPU or HSF needs to be lapped, i was more or less asking about the word "need" in that sentence. I'f I'm using an H70 with Arctic Silver 5, what kind of difference could I really expect to see by lapping? I'm thinking that if it's less than five degrees, there's no reason to do it until the computer is getting up in years and I'm trying to squeeze every last drop out of it, by which point the warranty is up anyhow. I realize that the benefit I'll see will depend on how badly the surfaces are warped, but, on average, what kind of drops are expected from lapping?

@thrasherht

That was an extremely informative thread. Thank you very much for sharing that with me. I'll definitely stick with ASUS and GIGABYTE boards from now on.
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post #16943 of 28351
From your point of view, no "need" then, because I think 5 degrees would be a best case scenario.

It helps ppls reply if you fill in system details in "UserCP", edit/add system .... so we know what components we're talking about.
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post #16944 of 28351
Well I can honestly say my temps dropped about ~10c when I lapped both my CPU and the cooling plate on my H50. Average temp before Lapp was ~45c Idle. I'm running 31c right this moment. That's with 6 windows open, 6 apps running in the task menu including PC Probe II.

Now that's not to say that the H50 is doing all that cooling. Because when I put my unlapped stock cooler on attempting to suss some issues out I got comparable temps with it on my CPU after the Lapp. That's with a C3 cooler though. I have no knowledge of whether or not the C2 cooler is the same as the C3.

But the lapp put my CPU at Ambient temp level. I won't go down any further until this Summer when the AC is running.

The temp shown in this pic is with my system sitting over the top of the heater and the temp outside at the time is in the upper Left corner of my desktop. 33c reported by PCP II.

~Ceadder
 
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post #16945 of 28351
Hey all.

I got my new sandy bridge rig up and running. I am very pleased with it

I had a little trouble installing the retention bracket on my new motherboard...
Eventually I got the screws to line up and I installed my H50. But then after I tightened all the screws I noticed the board was very skew

So I loosened them a bit and then installed the motherboard into the case and then re-tightened the H50 screws. At this point I have to mention that I removed the stock tim when I took it off the previous motherboard and reapplied a thinly spread as5 tim. What with the issues I had I may or may not have a good contact with the cpu now. So I want to hear your thoughts.

I get ~69-73 degrees C running blend prime95 at 4.5 GHz with vcore set at 1.3 V. It seems a little high, but then again I also don't have a very beefy fan on the rad. Ambient is around 22 degrees C.

At 5 GHz (1.43 V) it went over 80 degrees C after a minute blend.

I think it could be:
-there is no big problem, H50 is just too weak.
-poor positioning, need to reseat.
-poor tim and/or rough copper base on H50.

Thanks in advance for your thoughts
post #16946 of 28351
ASUS Probe? LOL i never use that anymore. Probably long time ago. What a waste of space imo. HWMonitor is good enough.
post #16947 of 28351
Ordered mine with a Corsair Graphite 600t !
I'll post pics after the build
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post #16948 of 28351
Quote:
Originally Posted by Ceadderman View Post
Well I can honestly say my temps dropped about ~10c when I lapped both my CPU and the cooling plate on my H50. Average temp before Lapp was ~45c Idle. I'm running 31c right this moment. That's with 6 windows open, 6 apps running in the task menu including PC Probe II.

Now that's not to say that the H50 is doing all that cooling. Because when I put my unlapped stock cooler on attempting to suss some issues out I got comparable temps with it on my CPU after the Lapp. That's with a C3 cooler though. I have no knowledge of whether or not the C2 cooler is the same as the C3.

But the lapp put my CPU at Ambient temp level. I won't go down any further until this Summer when the AC is running.

The temp shown in this pic is with my system sitting over the top of the heater and the temp outside at the time is in the upper Left corner of my desktop. 33c reported by PCP II.

~Ceadder
Hmmm. I think you did well then....or maybe it's that I live in the sub-tropics...?
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post #16949 of 28351
Quote:
Originally Posted by snorbaard View Post
Hey all.

I got my new sandy bridge rig up and running. I am very pleased with it

I had a little trouble installing the retention bracket on my new motherboard...
Eventually I got the screws to line up and I installed my H50. But then after I tightened all the screws I noticed the board was very skew

So I loosened them a bit and then installed the motherboard into the case and then re-tightened the H50 screws. At this point I have to mention that I removed the stock tim when I took it off the previous motherboard and reapplied a thinly spread as5 tim. What with the issues I had I may or may not have a good contact with the cpu now. So I want to hear your thoughts.

I get ~69-73 degrees C running blend prime95 at 4.5 GHz with vcore set at 1.3 V. It seems a little high, but then again I also don't have a very beefy fan on the rad. Ambient is around 22 degrees C.

At 5 GHz (1.43 V) it went over 80 degrees C after a minute blend.

I think it could be:
-there is no big problem, H50 is just too weak.
-poor positioning, need to reseat.
-poor tim and/or rough copper base on H50.

Thanks in advance for your thoughts
Reseat your H50. That's too high.

What you probably need to do is make sure you thread the bolts all the way through the nylon inserts until they free spin. You have two sets of threads per bolt. You want to be safely in between them. Then double check the steel inserts in the backing plate. Sometimes if you put just a little too much pressure on the screw and insert or two will pop out and free spin until it hits the MoBo tray and will score the metal. This happened to me. If your Ring doesn't rattle with the H50 in place prior to cinching it up then you know something isn't right. I'm pretty sure you have some air bubbles in your TIM which is causing that high of temps. An I'm very sure you don't want to run under Load for very long with those temps being posted.

@Room in general... Oh and HWMonitor reports the same temps that PC Probe II reports. There's not a damn thing wrong with Asus PC Probe II.

I use both of them. PC Probe II is there for 1st defense. HWMonitor is only better in that it gives you the Minimum/Maximum temp of the CPU where PC Probe II does not. In fact PC Probe II is better in that it has an actual alarm to alert you to an issue. Just don't have your speakers maxed out when you're gaming with a head set on. You'll jump right out of your skin(guaranteed) when that sucker goes off at full volume.

I love them both, but I'm kinda annoyed with HWM since it doesn't show my HDDs' the way it used to.It's nothing major since my Drives are kept chilly by the front Intake fan of my 932 but it is a minor annoyance.

~Ceadder


 
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post #16950 of 28351
Quote:
Originally Posted by Ceadderman View Post
The other drawback is going into it thinking you've got to take it all down to Copper. The point of lapping is to get the CPU as flat as possible so that the Thermal Interface Material(TIM) gets the best spread and as thin as possible without allowing contact between the two surfaces. There is no need to take it all the way down to Copper since that could possibly expose too much of the CPU and should your cooling surface make contact with it that's all she wrote. That CPU will be toast.

The way to find out if your CPU needs to be lapped, is to take the straightest edge you can and lay it on the surface of the CPU. Most NotB chips will have a dome in the middle and Rises on the sides. You just look at your CPU with the straight edge on it to see if you see daylight under it. Some chips won't have alot of that and won't need to be lapped as doing so wouldn't make a significant difference in cooling.

Was gonna add some pics but my stupid photobucket isn't cooperating.

~Ceadder
I thought the entire point of tim was to fill any air gaps between the two surfaces?
If you have two perfectly flat surfaces, how is tim going to improve the heat transfer from one surface to the other? If there are any air gaps between the two surfaces, the tim fills those gaps allowing better heat transfer. If there are zero gaps tim shouldn't be needed.

Of course, I suppose it will fill any micro gaps. I would sure like to see a comparison of tim and no tim on lapped CPU and cooler surfaces. I never really thought about it much until your comment, but it seems to me on perfectly flat metal surfaces you should get pretty good heat transfer with no tim at all.

Anyone ever test this?
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