Originally Posted by Xristo
curing the tim does drop temps , maybe 1-5c over a few months period .. depending on how you applied it .
I do reccomend using as5 thermal paste over the stock one , i got much better results .. even though people say shin etsu is like gold , i find it rubbish . First time i seated my h50 with the stock pad on it i got 50-60c idle temps .. now i lapped my cpu , block and used as5 and left it to cure i get 28-30c idle and good load temps for a h50 .
For people using amd processor , the pad has good amount of paste for coverage .. but for an i7 user , there is way too much TIM and all you need is a thin line across the HS not a big fat round pad .. it makes it a nightmare .
Im really impressed by the h50 , i dont think ill go custom loop ever if i get such good temps on this baby ...
Wow, IDLE temps of 50 to 60c? That seems to me to be more of a fault or seating problem, I would hardly blame it on the tim, especially considering in between testing you added a lapping. Hardly comparable.
There are quite a few other i7 users here. Anyone else get such high idle temps with stock tim? Any other i7 users require removal of most of the tim before use?
Considering the extensive testing that has been done on thermal pastes here and on other sites, I would hardly call the stock tim "rubbish".
You actually believe tim and a lapping reduced your temps 20 to 30c? IMHO, I find that hard to believe. I might get along with 5c for the lapping and maybe a few c for better tim, but according to all the other people here as5 is not better than the stock paste, but equivalent other than the curing time. as5 actually takes a lot longer to cure.
I haven't been here long, but everything you say goes against everything else I've read in this thread, and I read the entire thread amongst others.