Originally Posted by rusky1
Seems like I'm having a problem with my h110. It's setup in a push/pull configuration on my sig rig. CPU is 4.5ghz @ 1.23 vcore, uncore is 4.0ghz @ 1.05v
My idle temperatures are 30C but as soon as I start stress testing, using OCCT, temps jump all the way up to 80C within about 1 minute. Fans are set to max and the pump is running as well. I've installed the cooler 2 times now, first time was due to poor TIM application. A few people on here have I've seen use plastic spacers for the backplate in order to get a better mount. Is this something that is generally recommended?
Installed my H80i today to replace my H50. First installation 30C idle/80C+ linpack. Turns out I had a bit of space between the back bracket and PCB.
Went to Lowes got some spacers put two thin ones on each with the black plastic one at the end. Tightened everything. Tested again. 30C/65C @4.5GHz w/ mx-2 paste.
So yeah I also have an asrock board which is known to have thin PCB or metal back isn't as thick to push the mounting bracket. But yeah the spacers/additional washers worked for me.
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