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Dynex Thermal Compound... - Page 2

post #11 of 26
Thread Starter 
well considering the units arnt the same... not a damn thing. The bottom line, the artic silver is 88% pure silver by weight, Antec is 80%, and Dynex is only 50%
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post #12 of 26
Quote:
Originally Posted by pauldovi
well considering the units arnt the same... not a damn thing. The bottom line, the artic silver is 88% pure silver by weight, Antec is 80%, and Dynex is only 50%
Yeah, i understand .
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post #13 of 26
Maybe you used too much? Or got an air bubble? But really, something that's 50% silver shouldn't be worse than stock. I would reseat it if I were you and only use a small ammount this time.
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post #14 of 26
Thread Starter 
Quote:
Originally Posted by Fishie36
Maybe you used too much? Or got an air bubble? But really, something that's 50% silver shouldn't be worse than stock. I would reseat it if I were you and only use a small ammount this time.
Why would there be a problem with too much?
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post #15 of 26
Quote:
Originally Posted by pauldovi
Why would there be a problem with too much?
This is one of the most common mistakes with thermal paste, and it is infact a very big problem. Thermal paste is only needed to fill the microscipic valleys between the heatsink and cpu, so if you use more than a barely visable layer, it will insulate the cpu and cause very high temps. You're suppsed to use the ammount of half a BB (.177) in the very center and let the heatsink squish it out to avoid air pockets which are also very bad.
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post #16 of 26
Thread Starter 
Quote:
Originally Posted by Fishie36
This is one of the most common mistakes with thermal paste, and it is infact a very big problem. Thermal paste is only needed to fill the microscipic valleys between the heatsink and cpu, so if you use more than a barely visable layer, it will insulate the cpu and cause very high temps. You're suppsed to use the ammount of half a BB (.177) in the very center and let the heatsink squish it out to avoid air pockets which are also very bad.
Thanks! Rep!
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post #17 of 26
Thread Starter 
Quote:
Originally Posted by Fishie36
This is one of the most common mistakes with thermal paste, and it is infact a very big problem. Thermal paste is only needed to fill the microscipic valleys between the heatsink and cpu, so if you use more than a barely visable layer, it will insulate the cpu and cause very high temps. You're suppsed to use the ammount of half a BB (.177) in the very center and let the heatsink squish it out to avoid air pockets which are also very bad.
I re-applied the thermal compound. Computer would only start for a few seconds... then beep and turn off. I took off the heatsink, and there wasnt even any contact between the two. So, I added a smidge more, and then properly installed the heatsink (one the the mounts didnt connect properly, stupid 775). Now I am idling around 52C, which is a 13C inprovement! Thanks guys!
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post #18 of 26
Quote:
Originally Posted by pauldovi
I re-applied the thermal compound. Computer would only start for a few seconds... then beep and turn off. I took off the heatsink, and there wasnt even any contact between the two. So, I added a smidge more, and then properly installed the heatsink (one the the mounts didnt connect properly, stupid 775). Now I am idling around 52C, which is a 13C inprovement! Thanks guys!
Hmmmm.....you sure your HS isn't defective? Because even if I don't get my XP-90 on all the way, it still contacts in some way......
 
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post #19 of 26
Thread Starter 
I talked to several people with Intel 775 HS, they are buggers to install....
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post #20 of 26
As pointed out in some other forum articles, thermal conductivity and thermal conductance are different terms and calculated differently. See http://en.wikipedia.org/wiki/Thermal_conductivity for more info. I think the marketing folks for AS5 have taken advantage of the confusion surrounding the two terms.

The package specs on Dynex and AS5 are as follows:

Dynex: >8.2W/mK
AS5: >8.7W/mK

C stands for Celsius and K for Kelvin and I've see the C mistakenly substituted for K on some packaging and ads.

So if you go purely by the manufacturers specs, there's not that much difference in thermalconductivity. However, being a curious sort, I have a tube of each and will try to conduct comparison tests. I'll let you know how it goes.
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