Originally Posted by shizdan
Well I used the dot method and apparently its not good with HDT coolers. Any help?
The best method for applying TIM on a HSF be it HDT or not is to use the thinnest film of TIM across the entire contact surface. We're talking .003" or less TIM which is difficult for many people to apply properly. This is why the uncooked grain of rice or pea methods were developed because most people use about ten times or more the amount of TIM they should use. More TIM is NOT good as TIM is a thermal insulator.
TIM is only intended to fill the micro scratches or low spots in the metal surfaces. TIM is an insulator compared to metal-to-metal contact. You want 100% metal-to-metal contact but this is not possible so the least amount of TIM should be used ONLY to fill the minute scratches or low spots
. More TIM is BAD for thermal conduction and CPU cooling.Edited by AMD4ME - 6/22/12 at 10:37am