Originally Posted by macca_dj
Have you ever thought of testing Different Methods by the Calculation of Gaining more Knowledge in the Areas that you Attain your life to,
( further more your Money ).
I will test the Methods that suit me ( To some My methods may seem like madness ) to gain a fuller understanding of the conductance materials that in some cases i may find i can do without,
Saving me Money and the worry of ( Did it seat Properly and do i have Air Pockets ),
I have Direct Contact Between two surfaces TIM is a Third Part that i may find im better Off without.
Nobody is saying it wont work if you dont use a TIM. (or shouldn't)
A TIM is a thermal interface material. Your choice of TIM is dependant on what thermal interface you want... some fillers are literally that (have a low conductivity.) and transfer very little heat then at the other end of the spectrum there are the TIMs with much higher thermal conductivity and are applied strictly to speed heat from one surface to another.
There is no need to "trap heat" in a TIM unless you intend to by using a low conductivity material.
Most TIMs intending for PC use will in the main work better than no TIM, assuming correct aplication.
Why ? because no metal surface is truly flat you can machine a surface to very high standard and as flat as it feels to you I guarantee it wont be truly flat and lapping wont get it truly flat either it is due the physical make up of the metal. There will be hills and valleys on the CPU surface and hills and valleys on the Heatsink and where all the hils meet you will have trapped air in the valleys ( and incidently where the hills touch you will get good conductivity.) - period and you can't change that fact.
The purpose of high conductivity TIMs is to fill in the valleys with something that transfers heat faster than air...not necessarily a metal based paste.Edited by zipdogso - 4/18/10 at 5:10pm