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post #31 of 43
If the sensors are bad they will still display the wrong temps. no matter if you're in Windows or in BIOS. My temps. in BIOS are 38*C just so you know. I know for a fact that my MOBO is overstating CPU temps. but I have no idea by how much (it could be by as much as 10*C or as little as 1*C for all I know). I just keep the load temps. below 50*C just to be safe. As for measuring CPU temps. by other methods, I don't think their is a way to accuratly do it unless you find a way to place the sensor right on the core, because if you place it on the IHS you won't be even close to accurate.
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post #32 of 43
Thread Starter 
I reapplied the AS5 for a second time.....and it has worked. Previously I had been spreading the AS5 in a thin layer over the CPU. When I checked the bottom of the TT BT there no AS5 has transferred to the middle of the copper plate. I think this means that the TT BT wasnt properly seated on the CPU (although I did tighten the screws pretty tightly).

This time I decided to try putting a blob of AS5 in the middle of the CPU and allowing the TT BT's enourmous weight to spread out the AS5. This way there would definitely be some AS5 in contact with the middle of the CPU.

Now my load temps at 1.52V (slightly higher Vcore than before) have dropped from 51C to around 45C.

Although this method of TIM application seems to work better for me, many people have said to do it the spreading way. What is best???
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post #33 of 43
Quote:
Originally Posted by rustynator
Although this method of TIM application seems to work better for me, many people have said to do it the spreading way. What is best???
For processors with a heatspreader, the blob way. For processors without one, spread it evenly.
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post #34 of 43
Thread Starter 
Do you think the reason why the AS5 only came in contact with the HSF at the sides is due to a uneven CPU or HSF surface? I am seriously thinking about lapping my HSF to try and get a lovely shiny and even surface on the IHS. What do you think...should I or shouldnt I??
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post #35 of 43
Quote:
Originally Posted by rustynator
I reapplied the AS5 for a second time.....and it has worked. Previously I had been spreading the AS5 in a thin layer over the CPU. When I checked the bottom of the TT BT there no AS5 has transferred to the middle of the copper plate. I think this means that the TT BT wasnt properly seated on the CPU (although I did tighten the screws pretty tightly).

This time I decided to try putting a blob of AS5 in the middle of the CPU and allowing the TT BT's enourmous weight to spread out the AS5. This way there would definitely be some AS5 in contact with the middle of the CPU.

Now my load temps at 1.52V (slightly higher Vcore than before) have dropped from 51C to around 45C.

Although this method of TIM application seems to work better for me, many people have said to do it the spreading way. What is best???
Check towards the end (step 9):
http://www.arcticsilver.com/arctic_s...structions.htm
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post #36 of 43
Thread Starter 
Well that would suggest that the non spreading method is best. What do you think about lapping the CPU?
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post #37 of 43
It's probably a different location, and the quality of DFI's thermal probes.
    
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post #38 of 43
Quote:
Originally Posted by Melcar
If I am idleing at 30 to 31c, would it be worth it to redo my AS5 application? I was scared to do the drop in the middle so I spread it out. Seems to be ok. Thanks for the link!
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post #39 of 43
Quote:
Originally Posted by rustynator
Do you think the reason why the AS5 only came in contact with the HSF at the sides is due to a uneven CPU or HSF surface? I am seriously thinking about lapping my HSF to try and get a lovely shiny and even surface on the IHS. What do you think...should I or shouldnt I??
The IHS is a bit odd in a way.
THe center is firmly pressed against the actuall CPU core, the outer edges offer stability. So, the center ususlly has very little thermal paste on it when you remove the FHS for inspection. The some what outer edges between the center but not at the extreme edge tend to have the highest film build of paste!
That in itself is why some run naked and remove the IHS which is very risky, a few others prefer to remove it, clean off the crappy white paste from under the HIS and on the the CPU core and replace it with AS5 and reattach the IHS for near naked thermal transfer and safer FHS mounting with the usual AS5 between the IHS and FHS!
    
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post #40 of 43
Thread Starter 
When I inspected the CPU, the centre of the IHS had not be in contact with the HSF plate at all. Surely this is a major problem as this is the main area of heat dissipation. Does lapping solve this problem by removing the concave (or possibly convex, I am never sure) nature of the CPU, or does it simply smooth down the surface of the CPU? Should I give it a go?
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