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post #41 of 43
Duke's Methods of CPU/IHS/FHS lapping.
If it's done properly, lapping will flatten the surface.

A DUKE TIP!
Since your lapping and the CPU unit can no longer get RMAed, the plastic shipping container can be trimed off and used to hold the CPU "

1. Automotive refinnishing "Wet/Dry'' sand paper works best with a little dishwashing soap. A drop in a bowl of warm water and let stand till cool.
If you can aquire emery cloth in very fine grits it works well to, which is commonly used to finish bearing surfaces in machines and automotive engines but should be used dry but is far more agresssive vs the "Wet/Dry" sand paper.
2. Place the sheet of sand paper on a flat surface. A formica counter top or sheet of glass works well. Put a few sheets of newspaper under it to protect the counter top.
3. Sanding method
a. very little water/soap to avoud flooding the paper
b. Count the strokes and folow 3c
c. x amont strokes with very little preasure in a back and forth movement.
d. Rotate the CPU 90° and repeat 3c
e. repeat 3d
f. repeat 3d
d.3c-f provides a sanding method that sands against the precious etching at 90° which is benifical to the process an uniformly flattens the surface.
Some will acertain circular sanding which also works weel if you rotate the CPU as above stated ie. 90° rotation in controled intervals.
The rotation is necessaty because one tends to apply more preasure twards the edge that is being "pushed" in the process.

In the progressive lapping method, the coarser paper levels the surface, so watch the IHS/FHS and do not try to flatten it completly with the coursest grit. The finer stages will complete the flattening as you progress so get most of the flattening but not all of it with the courser grit paper, about 75-80% will surfice.
400 or 600 to start, 800, 1200 and as you prefer as high as 1500, 2000. 3000g is available but personally, a waste of money.
    
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X4 965 ASUS M4A79 Deluxe 9800GTx2 2x2G OCZ Reapers 
Hard DriveOptical DriveOSMonitor
500G WD Black LiteOn CD/DVD R/W Win7 64 22'' ws Acer AL2223W 
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MS KU462 Natural SS DA750 MS 5 button 
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post #42 of 43
I think the sensors on your old board were wrong. Also when you put sAS5 on you only need a MICRO!! thin layer. In most cases the key word is UNCOOKED rice, and I even use less than that.
post #43 of 43
Thread Starter 
Quote:
Originally Posted by Crash
I think the sensors on your old board were wrong. Also when you put sAS5 on you only need a MICRO!! thin layer. In most cases the key word is UNCOOKED rice, and I even use less than that.
That is what I was thinking. The A8N didnt seem that responsive to an increase in Vcore with respect to the load temps. On the DFI, an increase from 1.40V to 1.50V results in about a 7C increase in comparison to a 3C or so rise with the A8N.

Right, so I have put together a plan of action:
1) Lap the TT BT's copper plate with Duke's method
2) Remount the HSF using the spreading method and a very thin layer of AS5
3) Buy a silverstone 110cfm 120mm fan for the TT BT (as long as it doesnt sound like a jet taking off)
4) Cry like a baby if this doesnt work

Hopefully this will get me down to 40C load temps, then I will have a shot at 3GHz. As a last resort I might lap the IHS, but at the moment I an unsure about whether the benefits outweigh the losses (i.e. warranty and reduced price when I choose to sell the CPU).

Does this seem like the right course of action? Any other suggestions? Also, is spreading AS5 a better idea than allowing the HSF to spread out the AS5? Cheers
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