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MSI GTX465 Twin Frozr II Golden Edition Owners Club - Page 194

post #1931 of 5083
Quote:
Originally Posted by Greeen_Machine View Post
My 2nd 465 is dead crap . The 2 outer pins came like broken and the fan is missing a blade is it makes a **** load of noise. And it doesnt produce a picture


On a lighter note, is that Vanessa Hudgkins (or w/e her name is) in your avatar?
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post #1932 of 5083
Quote:
Originally Posted by kidwolf909 View Post
Dang man... this is heartbreaking! I'm sorry for your troubles without any returns.

I think, as you said, the removal of copper probably wore down the base to a point where the screws no longer tighten enough to hold the heat sink down against the board tightly.

Just take the standoffs that you mentioned, put one in a pair of vice grips, and then use the lapping paper to sand them down by 2-3mm. That should help. Also, I hope you didn't remove the heatpipes from the contact plate in order to lap it. I'm sure you didn't since you're experienced, but I had to be sure.



Two outer pins?

Time for RMA! Just get a new one.
Yeah like the pins that plug into the PCI-E slot. the long set of pins. The outer one on each side is messed up. I wanna RMA but im scared there gonna blame it on me
post #1933 of 5083
Quote:
Originally Posted by xxbassplayerxx View Post


On a lighter note, is that Vanessa Hudgkins (or w/e her name is) in your avatar?
Yes it is
post #1934 of 5083
Quote:
Originally Posted by Greeen_Machine View Post
Yes it is
I like the other pictures better!

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post #1935 of 5083
Quote:
Originally Posted by xxbassplayerxx View Post
I like the other pictures better!

Me2
post #1936 of 5083
Quote:
Originally Posted by kidwolf909 View Post
Dang man... this is heartbreaking! I'm sorry for your troubles without any returns.

I think, as you said, the removal of copper probably wore down the base to a point where the screws no longer tighten enough to hold the heat sink down against the board tightly.

Just take the standoffs that you mentioned, put one in a pair of vice grips, and then use the lapping paper to sand them down by 2-3mm. That should help. Also, I hope you didn't remove the heatpipes from the contact plate in order to lap it. I'm sure you didn't since you're experienced, but I had to be sure.
Thanks for the words of sympathy. It is really sucky ATM. 5C hotter is DEFINITELY NOT what I wanted to see. That's one ****ton of a lot hotter when you're already dealing with high temps on the top card.

I basically know how to file down the standoffs, but the $20 packet of micromesh (well, the coarse pieces anyways) are already shot from all the grinding. And I shudder to think how hard it would be to grind these (much harder metal) stand-offs, and make sure they end up totally flat across all four.

I'm hoping this TIM just needs some time to cure and that's the issue here. I'm thinking worse comes to worse, I just move this card to the bottom spot then the higher temps won't matter too much.
    
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post #1937 of 5083
Quote:
Originally Posted by brettjv View Post
Well, 4 hours of back-breaking labor (it's friggin KILLING me today) and $35 of materials later, and my lap job on my top card was a total fricking FAIL.

Load temps are up by 5C. I used a very thin coating of the Antec Formula 5 Silver (not AS5 but similar) compound across the whole chip, which is not the greatest paste but I've gotten decent results with it before. It should not be the reason for the higher temps.

To answer your question, the base was not concave, but it definitely had a slope to it. It took me a LONG time using MicroMesh (1500 is the coarsest, and it's really not coarse enough for any serious grinding, hence the friggin HOURS of labor) to get it flat.

Taking the cooler off is easy, but further stripping it down (and more so putting it back together) to lap it was a drag. There's so many REALLY tiny screws, you better have patience, eyesight, and dexterity galore.

I think maybe I also need to file down the stud-things that are attached to the base that encase the mounting screws. Maybe with my grinding I created too much offset/clearance between base and chip. That would really suck, they seem to be some really hard metal and I don't have the tools to do it. I suppose I could compensate by making the TIM even thicker, but that really defeats the whole purpose of the job ...

I'm very today.


Sweet BP ... welcome to our little club

brett, I also tried AS5 last night on my 465GE and I got temps of +5C as well. When I used Shin Etsu X23 it was +2C. Ugh this confirms that the stock stuff is really damn good. AS5 does have a break-in period of 200 hours, but I highly doubt it'll drop 5C in that time. I'll let it run a few more days and check temps before I go back to Shin Etsu...
    
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post #1938 of 5083
Quote:
Originally Posted by brettjv View Post
Thanks for the words of sympathy. It is really sucky ATM. 5C hotter is DEFINITELY NOT what I wanted to see. That's one ****ton of a lot hotter when you're already dealing with high temps on the top card.

I basically know how to file down the standoffs, but the $20 packet of micromesh (well, the coarse pieces anyways) are already shot from all the grinding. And I shudder to think how hard it would be to grind these (much harder metal) stand-offs, and make sure they end up totally flat across all four.

I'm hoping this TIM just needs some time to cure and that's the issue here. I'm thinking worse comes to worse, I just move this card to the bottom spot then the higher temps won't matter too much.
Oh man...
So sorry to hear it about this. I am not usually a glass if half-full kinda guy but maybe it is just the TIM needing to cure.
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post #1939 of 5083
ok I'm selling my MSI GTX 465 GE, if any one is interested pm me.
its flashed to 470 with theses clocks 880/1600/1848 @ 1.088v stable, just got done folding 2 day s straight.
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post #1940 of 5083
More news on the lapping ...

So, by all appearances, it's seems this chip itself is simply not flat. Taking it apart, I discovered what appears to be a significant amount of concaveness in the general area of the the center. I deduce this because I found a fairly large (about 1/4 of the total contact area) where the TIM had not made contact with the cooler base, even though I know the base is flat, and my application of the tim was very even..

So I gooped on the TIM in that area, and put a bunch of dots in the areas where the contact had been good. I'm seeing a 1C drop in the idle temp, hopefully it translates to more than that on load. I'll check load temps tonight.

Edit: curiosity got the better of me ... no difference on load. My top card is still 20C hotter than the bottom card, just like last night, post-lapping. Prior to the lapping, only 15C separated them.

Looks like I'm going to need to do the TIM again, with a really careful application in the area of concavity instead of the glop method.

SO frustrating.
Edited by brettjv - 8/13/10 at 10:35am
    
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