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MSI GTX465 Twin Frozr II Golden Edition Owners Club - Page 440

post #4391 of 5083
My cards are still running strong. I got them when they initially came out and flashed to 470 with no problems. I've posted somewhere in this thread...
Been running both cards (SLI)@ 1013v @720mhz core/1750mhz RAM for the last few months.
Had very good results OCing to somewhere in the low 800s, but the above setting have been rock solid for me for daily use. Fan on AUTO, cards heat up to mid-high 60s, and once in a while low 70s.
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post #4392 of 5083
Nevermind what this post originally was, new driver seemed to fix my issue.
Edited by Markisa - 11/3/10 at 2:39pm
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post #4393 of 5083
So i finally got the stuff i ordered.

Room temp is from 22ºC to 24ºC great weather today.

Here is the result of using the spread method. Not as good as i thought it was.



Got the card cleaned and prepared with the arctic cleaning kit. Amazing stuff BTW.



I used the pea method in the center of the chip and i led the heatsink doing the job of spreading the MX-3



I also added 2 120mm fans to add more airflow to the case.

So i fired up the PC ran OCCT and now my temps are max @ 72ºC. Everything is in stock clocks. With furmark even better my max temp is 70ºC.

So i tried my overclocked profile which was stable the last time i raned OCCT 1.075Mv 760/1740. And OCCT gave me a lot of errors within 3 minutes into the test. And finally made my drivers crash.

The weirdest thing is that on furmark with Extreme Burning Mode and 4xMSAA the card is flawless for 20 min. Hell i even got it to 825/1740 without crashes and my card never passed the 74ºC.And also passed the 3d mark vantage test (scored in the 19,000)

So i really don't know which way to go here. What do you recommend me to keep using to stress the card???. I really don't know why Furmark can stand a good 20 min and OCCT cant stand 3.

A big thanks to twocables which pointed me in the right direction.

Thanks for your time.

Shremi


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post #4394 of 5083
Personally, to me, if it doesn't crash when gaming, then it's stable. I could give a flying one about Furmark or OCCT. But that's just me.
    
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post #4395 of 5083
You're welcome, Shremi. Now if I could only convince the rest of OCN to use the same thermal paste application method...
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post #4396 of 5083
I'm a "let the sink do the spreading" man myself. I really don't understand why anyone would do it any other way, and your pictures prove why. That's a rather large empty spot right over top the center of the GPU in your first pic. Not good!

Anywho, I'm with Brett shremi. If I can play my games without crashes, it's stable enough for me, because that's the only thing that matters! This weekend I'm going to play a little more with my OC as well... right now it's very mild.
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post #4397 of 5083
Quote:
Originally Posted by Cavi View Post
I'm a "let the sink do the spreading" man myself. I really don't understand why anyone would do it any other way, and your pictures prove why. That's a rather large empty spot right over top the center of the GPU in your first pic. Not good!

Anywho, I'm with Brett shremi. If I can play my games without crashes, it's stable enough for me, because that's the only thing that matters! This weekend I'm going to play a little more with my OC as well... right now it's very mild.
The spot without the TIM is not *necessarily* a bad thing. If the contact between the hsf and chip is perfect in that location, then you don't need there to be TIM in between. In a perfect world, you don't need TIM at all. It's purpose is to fill in gaps due to surface imperfections/mismatches.

Also, with the other method you speak of, there's an uncovered area all around the edge of the TIM circle. And you have no way of knowing whether TIM isn't there because there just wasn't enough dumped into the middle, or because the contact is actually perfect all around the edges
    
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post #4398 of 5083
Quote:
Originally Posted by brettjv View Post
The spot without the TIM is not *necessarily* a bad thing. If the contact between the hsf and chip is perfect in that location, then you don't need there to be TIM in between. In a perfect world, you don't need TIM at all. It's purpose is to fill in gaps due to surface imperfections/mismatches.

Also, with the other method you speak of, there's an uncovered area all around the edge of the TIM circle. And you have no way of knowing whether TIM isn't there because there just wasn't enough dumped into the middle, or because the contact is actually perfect all around the edges
But isn't there still enough TIM above the core(s)?

I have never applied TIM to my CPU in any other way than this (the method that worked for Shremi), and I always get results that cause others to say that my temps are right where they should be. And each time, I always have about that much coverage.

I don't know... it just doesn't seem logical to me to apply paste in any other way because then I run the risk of creating air pockets.
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post #4399 of 5083
IMHO the method of the PEA on the center eliminates the human part of spreading the TIM.

I am not saying the spread method will always fail, since i used it for both of my cpus and both are running with great temps. But when you use this method there is a slight possibility of creating air pockets. I had to learn the hard way that the spread method isn't the best at all.

Again thanks to everyone who had the patience to bare with me. I am going to try gaming heavily with my card and see if my overclock fails in the games.

A little off topic but I think i am falling in love with my new card. It is so nice to never see your temps go above the 75ºC, with a decent overclock and a decent voltage.


I think i had a terrible card but naaahhh all it needed was a little tweaking and some love .

Thanks to everyone on this thread who helped me.

Shremi
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post #4400 of 5083
Quote:
Originally Posted by shremi View Post
IMHO the method of the PEA on the center eliminates the human part of spreading the TIM.

I am not saying the spread method will always fail, since i used it for both of my cpus and both are running with great temps. But when you use this method there is a slight possibility of creating air pockets. I had to learn the hard way that the spread method isn't the best at all.

Again thanks to everyone who had the patience to bare with me. I am going to try gaming heavily with my card and see if my overclock fails in the games.

A little off topic but I think i am falling in love with my new card. It is so nice to never see your temps go above the 75ºC, with a decent overclock and a decent voltage.


I think i had a terrible card but naaahhh all it needed was a little tweaking and some love .

Thanks to everyone on this thread who helped me.

Shremi
It's especially nice to see temps like that coming from a GTX 470.

But yeah, I love how you took a GTX 470 that was binned as a GTX 465, and then played the role of the manufacturer and made it totally comfortable as a GTX 470. If a manufacturer had done that, then they would charge a very high price for it!
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It's a computer!
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