Overclock.net › Forums › Cooling › Air Cooling › How to use AS5 effectively ?
New Posts  All Forums:Forum Nav:

How to use AS5 effectively ? - Page 2

post #11 of 21
Usually, no matter how many times you've spread AS5 before, it won't be completely even. For minimal hassle, just do what the AS5 site says. small blob in the center. There's no need to cover the entire heatspreader. For a demo, try the blob, then pull the sink off and look at how it spreads out. It does a pretty good job on its own.
Wolfdale
(13 items)
 
  
CPUMotherboardGraphicsRAM
E5200 @ 3.15 GHz ASRock P43TWINS1600 Radeon HD4670 4GB Super Talent 
Hard DriveOptical DriveOSMonitor
1TB Caviar Black, Caviar 250GB NEC Windows 7 x64, Vista 32 20" 
KeyboardPowerCaseMouse
Apple, yes, Apple. Antec Smartpower 500 Antec Solo Logitech MX700 
  hide details  
Reply
Wolfdale
(13 items)
 
  
CPUMotherboardGraphicsRAM
E5200 @ 3.15 GHz ASRock P43TWINS1600 Radeon HD4670 4GB Super Talent 
Hard DriveOptical DriveOSMonitor
1TB Caviar Black, Caviar 250GB NEC Windows 7 x64, Vista 32 20" 
KeyboardPowerCaseMouse
Apple, yes, Apple. Antec Smartpower 500 Antec Solo Logitech MX700 
  hide details  
Reply
post #12 of 21
Ok, the first time I set up my rig I was idle 21c and load 31c and that was when I put a pea sized amount of AS5 in the middle of the CPU. I got another mothboard so I reapplied AS5 but this time I did the thin spread layer over the entire surface of the CPU. My idle then became 30c and load almost 40c. Just an hour ago I cleaned off the AS5 and reapplied again a pea sized amount of AS5 in the center. My temps are back to 21C//31C.

Each time I made sure that I seated the HSF correctly and tight and had my rigg on for over a week each time I applied AS5. I hadnt even let the AS5 settle this time and I am already seeing a great difference in temps with the different techniques.

Obviously the pea-sized AS5 technique worked a whole lot better for me and I'm more than certain it should for you.
Daily
(16 items)
 
  
CPUMotherboardGraphicsRAM
AMD FX-8350 Vishera ASUS M5A97 LE R2.0 AM3+ AMD 970 Gigabyte Nvidia Geforce GTX 660 G.SKILL Ares Series 16GB 
Hard DriveHard DriveHard DriveOptical Drive
Western Digital Raptor Western Digital Western Digital Sony Optiarc DVD/CD Rewritable Drive 
OSMonitorKeyboardPower
Windows 7 Professional Dell 20" E207WFP  Saitek Eclipse II Antec EarthWatts EA750 750W 
CaseMouseMouse PadAudio
AOpen Nouveau Razer DeathAdder REVOLtec Gampad Precision Advanced Creative Sound Blaster Audigy  
  hide details  
Reply
Daily
(16 items)
 
  
CPUMotherboardGraphicsRAM
AMD FX-8350 Vishera ASUS M5A97 LE R2.0 AM3+ AMD 970 Gigabyte Nvidia Geforce GTX 660 G.SKILL Ares Series 16GB 
Hard DriveHard DriveHard DriveOptical Drive
Western Digital Raptor Western Digital Western Digital Sony Optiarc DVD/CD Rewritable Drive 
OSMonitorKeyboardPower
Windows 7 Professional Dell 20" E207WFP  Saitek Eclipse II Antec EarthWatts EA750 750W 
CaseMouseMouse PadAudio
AOpen Nouveau Razer DeathAdder REVOLtec Gampad Precision Advanced Creative Sound Blaster Audigy  
  hide details  
Reply
post #13 of 21
Thread Starter 
thanks guys for all the tips, I will try both technique and choose one which is best temps result. So far I have tried the AS5 spread out only but have'nt done any small drop on the middle of the CPU yet. Will try it sometimes next week or so
post #14 of 21
I think it depends on how smooth your heatsink is. the smoother it is, the less compound is needed to fill in the gaps. with a stock heatsink, you are going to need a little more to fill in all the gaps.
HTPC
(13 items)
 
  
CPUMotherboardGraphicsRAM
i3 2120T Gigabyte Z68XP-UD3 i3 HD2000 8gb Kingston HyperX Blu 
Hard DriveOptical DriveOSMonitor
9.5 TB Storage Samsung BD-ROM Windows 7 Prof 47in LG LCD 
KeyboardPowerCaseMouse
I/O Gear Wireless 500W FSP CM690 Dell M2010 Remote 
  hide details  
Reply
HTPC
(13 items)
 
  
CPUMotherboardGraphicsRAM
i3 2120T Gigabyte Z68XP-UD3 i3 HD2000 8gb Kingston HyperX Blu 
Hard DriveOptical DriveOSMonitor
9.5 TB Storage Samsung BD-ROM Windows 7 Prof 47in LG LCD 
KeyboardPowerCaseMouse
I/O Gear Wireless 500W FSP CM690 Dell M2010 Remote 
  hide details  
Reply
post #15 of 21
That's true too. The AS website says a lapped heatsink needs only a "translucent haze" of AS5.
Wolfdale
(13 items)
 
  
CPUMotherboardGraphicsRAM
E5200 @ 3.15 GHz ASRock P43TWINS1600 Radeon HD4670 4GB Super Talent 
Hard DriveOptical DriveOSMonitor
1TB Caviar Black, Caviar 250GB NEC Windows 7 x64, Vista 32 20" 
KeyboardPowerCaseMouse
Apple, yes, Apple. Antec Smartpower 500 Antec Solo Logitech MX700 
  hide details  
Reply
Wolfdale
(13 items)
 
  
CPUMotherboardGraphicsRAM
E5200 @ 3.15 GHz ASRock P43TWINS1600 Radeon HD4670 4GB Super Talent 
Hard DriveOptical DriveOSMonitor
1TB Caviar Black, Caviar 250GB NEC Windows 7 x64, Vista 32 20" 
KeyboardPowerCaseMouse
Apple, yes, Apple. Antec Smartpower 500 Antec Solo Logitech MX700 
  hide details  
Reply
post #16 of 21
I'd just go with what AS have to say about their own product, they have done tests on either method and concluded that spreading from a blob in the center is better

Quote:
Our testing has shown that this method minimizes the possibility of air bubbles and voids in the thermal interface between the heat spreader and the heatsink. Since the vast majority of the heat from the core travels directly through the heat spreader, it is more important to have a good interface directly above the actual CPU core than it is to have the heat spreader covered with compound from corner to corner.
post #17 of 21
I would definitely give the spreading method a try. I used that method first time round and got crappy temps (50C load) because I did a bad job of it. I switched to the blob technique, which brought the temps back to 43-44C load. Yesterday I retried the spreading method and my temps have dropped again to 41C (without cure time).

Give both a shot, and see what works
My System
(13 items)
 
  
CPUMotherboardOSMonitor
AMD 3700 KACAE 0602GPMW DFI LanParty nF4 SLI-DR XP Pro SP2/Vista Beta 2 Samsung SM930BF 19" TFT 
KeyboardPowerCaseMouse
Microsoft Tagan U22 480W Thermaltake Tsunami Microsoft 
  hide details  
Reply
My System
(13 items)
 
  
CPUMotherboardOSMonitor
AMD 3700 KACAE 0602GPMW DFI LanParty nF4 SLI-DR XP Pro SP2/Vista Beta 2 Samsung SM930BF 19" TFT 
KeyboardPowerCaseMouse
Microsoft Tagan U22 480W Thermaltake Tsunami Microsoft 
  hide details  
Reply
post #18 of 21
Even though we(some of us) use air to cool our rigs....

Air, though great as an insulator, tranfers heat poorly.

Ideally, both the surface of the CPU housing and the surface of your heatsink would be so flush and flawless that you wouldnt need to use a thermal compound to transfer heat from CPU-to-heatsink.

But, because of micro-imperfections on the surfaces of the CPU and heatsink, the two surfaces arent TOTALLY flat, thus perfect contact is not possible. This allows air to fill the microscopic "valleys" and imperfections on the surfaces of the CPU and heatsink.

Remember, AIR acts as an insulator, thus, the air trapped inside these "valleys" and imperfections between the CPU and heatsink impedes the ability of the heat from the CPU to dissipate into the heatsink.

THATS why we use a thermal compound...

To eliminate the possibility of insulating air between our CPU and heatsink.

BUT!!! Unfortunately, though better at transfering heat than air, thermal compound still isnt perfect, and doesn't transfer heat as well as say...pure copper or aluminum. Big globs of thermal compound won't transfer heat very well at all. Thats what the heatsink is for.

So why smother it and prevent it from doing its job? Follow the directions.
Nihilinux
(11 items)
 
  
CPUMotherboardGraphicsRAM
Phenom II X4 840  ASRock M3A770DE+  Sapphire R9 270 X Vapor-X 2GB 14GB G. Skill Sniper Series DDR3-2133 
Hard DriveCoolingOSMonitor
2x 500GB Seagate Barracuda SATA6Gb/s  Modded/Machined ThermalTake SilentBoost  LinuxMint17/Windows 7 Ultimate 46" Insignia NS-46D40SNA14 /19" HP w1907 
PowerCase
1000 Antec TruePower Quatro  Modded/Painted (Black/Orange) Antec PlusView 10... 
  hide details  
Reply
Nihilinux
(11 items)
 
  
CPUMotherboardGraphicsRAM
Phenom II X4 840  ASRock M3A770DE+  Sapphire R9 270 X Vapor-X 2GB 14GB G. Skill Sniper Series DDR3-2133 
Hard DriveCoolingOSMonitor
2x 500GB Seagate Barracuda SATA6Gb/s  Modded/Machined ThermalTake SilentBoost  LinuxMint17/Windows 7 Ultimate 46" Insignia NS-46D40SNA14 /19" HP w1907 
PowerCase
1000 Antec TruePower Quatro  Modded/Painted (Black/Orange) Antec PlusView 10... 
  hide details  
Reply
post #19 of 21
Yeah...I put tons of AS5 on my CPU (I can't even clean it out anymore) and it runs at 48C and it's not even stock, I use the all pure copper Zalman. But the funny thing is, if it step back my Bios...it is only 28C....I just don't understand why it do that. No idea.
My System
(13 items)
 
  
CPUMotherboardGraphicsHard Drive
C2D E6300 PB5 Deluxe WiFi 7300GT 250GB SAMSUNG 
OSMonitorKeyboardPower
Win XP Professional SP2 SyncMAster 713v BenQ 550HeAntec 
CaseMouse
Lian-Li G5 
  hide details  
Reply
My System
(13 items)
 
  
CPUMotherboardGraphicsHard Drive
C2D E6300 PB5 Deluxe WiFi 7300GT 250GB SAMSUNG 
OSMonitorKeyboardPower
Win XP Professional SP2 SyncMAster 713v BenQ 550HeAntec 
CaseMouse
Lian-Li G5 
  hide details  
Reply
post #20 of 21
Quote:
Originally Posted by ColdTriton
Even though we(some of us) use air to cool our rigs....

Air, though great as an insulator, tranfers heat poorly.

Ideally, both the surface of the CPU housing and the surface of your heatsink would be so flush and flawless that you wouldnt need to use a thermal compound to transfer heat from CPU-to-heatsink.

But, because of micro-imperfections on the surfaces of the CPU and heatsink, the two surfaces arent TOTALLY flat, thus perfect contact is not possible. This allows air to fill the microscopic "valleys" and imperfections on the surfaces of the CPU and heatsink.

Remember, AIR acts as an insulator, thus, the air trapped inside these "valleys" and imperfections between the CPU and heatsink impedes the ability of the heat from the CPU to dissipate into the heatsink.

THATS why we use a thermal compound...

To eliminate the possibility of insulating air between our CPU and heatsink.

BUT!!! Unfortunately, though better at transfering heat than air, thermal compound still isnt perfect, and doesn't transfer heat as well as say...pure copper or aluminum. Big globs of thermal compound won't transfer heat very well at all. Thats what the heatsink is for.

So why smother it and prevent it from doing its job? Follow the directions.
very nicely put, +REP
HTPC
(13 items)
 
  
CPUMotherboardGraphicsRAM
i3 2120T Gigabyte Z68XP-UD3 i3 HD2000 8gb Kingston HyperX Blu 
Hard DriveOptical DriveOSMonitor
9.5 TB Storage Samsung BD-ROM Windows 7 Prof 47in LG LCD 
KeyboardPowerCaseMouse
I/O Gear Wireless 500W FSP CM690 Dell M2010 Remote 
  hide details  
Reply
HTPC
(13 items)
 
  
CPUMotherboardGraphicsRAM
i3 2120T Gigabyte Z68XP-UD3 i3 HD2000 8gb Kingston HyperX Blu 
Hard DriveOptical DriveOSMonitor
9.5 TB Storage Samsung BD-ROM Windows 7 Prof 47in LG LCD 
KeyboardPowerCaseMouse
I/O Gear Wireless 500W FSP CM690 Dell M2010 Remote 
  hide details  
Reply
New Posts  All Forums:Forum Nav:
  Return Home
  Back to Forum: Air Cooling
Overclock.net › Forums › Cooling › Air Cooling › How to use AS5 effectively ?