So your theory is that the increased surface area of the fins will lead to increased cooling with the water passing over them?
Or is it that the heatsink is more efficient at cooling so by using the high thermal conductivity of water in combination with the heatsink this method will produce lower temps?
I can't think of a reason why you would want to do this, maybe you could elaborate on your thinking to help us better understand why you think this will be more efficient? I think it would help the thread.
From what I can see, all you are doing is increasing the distance of thermal transfer between the water and the CPU, which is less efficient/more in-efficient, however you would like to put it. Like I said before, there is a reason direct die cooling is some of the best watercooling you can get without doing some type of chilling.
Putting some type of medium in between the water and the IHS can and will only decrease the cooling efficiency.
Or is it that the heatsink is more efficient at cooling so by using the high thermal conductivity of water in combination with the heatsink this method will produce lower temps?
I can't think of a reason why you would want to do this, maybe you could elaborate on your thinking to help us better understand why you think this will be more efficient? I think it would help the thread.
From what I can see, all you are doing is increasing the distance of thermal transfer between the water and the CPU, which is less efficient/more in-efficient, however you would like to put it. Like I said before, there is a reason direct die cooling is some of the best watercooling you can get without doing some type of chilling.
Putting some type of medium in between the water and the IHS can and will only decrease the cooling efficiency.











