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When applying Ther. Paste, spreading with the HS, use enough so ALL of CPU is covered

post #1 of 15
Thread Starter 
So last time when I installed my current single core P4 640, I put about a rice sized blob in the center, and used the action of the HS to spread it.

Then I took off the HS, and not all of the CPU was covered, so I added 2 more much smaller blobs off center, and reseated the HS and took it off, and the CPU was covered. So then I just put the HS back on.

Now in a few days when I seat my x3 (really an x4) shouldn't I do it that way.

Isn't it better to have a larger surface area with almost all the cores completely covered and in contact, than having less coverage over the cores, but potentially a slightly thinner layer.
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post #2 of 15
only a dab in the middle smaller than a pea and spread it with the Heatsink, No Twisting!
    
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post #3 of 15
Put a dab in the center, and then wrap your finger in a plastic bag. Use your finger to spread a THIN layer across the entire processor. Full coverage, and easy to do. Just make sure the layer of TIM is very THIN.
    
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post #4 of 15
I normally used a razor blade and put the paste on one side of the cpu and spread it till it was a thin layer all the way across.
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post #5 of 15
Thread Starter 

After just watching that, I think it was a bad idea seat HS, take off, and reseat HS, due to how easy air getting trapped seems
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post #6 of 15
Mit Namso, please keep in mind that thermal paste spreads even further on its own when heated when using the pea/rice in the center method. You can't expect it to provide full paste coverage of the IHS if you apply it and then check the spread without first powering on and stressing the system.

Quote:
Originally Posted by TurboTurtle View Post
Put a dab in the center, and then wrap your finger in a plastic bag. Use your finger to spread a THIN layer across the entire processor. Full coverage, and easy to do. Just make sure the layer of TIM is very THIN.
Quote:
Originally Posted by SpykeZ View Post
I normally used a razor blade and put the paste on one side of the cpu and spread it till it was a thin layer all the way across.
Quote:
Originally Posted by Chunky_Chimp View Post
I'm going to elaborate on pea-sized dot in the center vs. manually spreading, so this is put to bed (but probably not for very long):

Spreading it yourself does NOT guarantee an even spread, even if you think you've done it right. It doesn't matter what tool you used to spread it manually, there will always be discrepancies in how thin the coat is in one spot vs. in another spot x amount of millimeters away, even if you made every effort to be as even as possible. As I said before it also carries the risk of air bubbles, even ones you can't see, which is obviously detrimental to the performance of the material (and to an extent, defeats the purpose of it). This risk is carried no matter what tool you use, but it's readily evident if you use the plastic baggie method, since the surface of a plastic bag is extremely malleable and, wrapped around a finger, CANNOT be completely smooth unless you've just taken it out of the box or roll; even then it'll change as you form it around your finger and lose the smoothness.

These issues are all avoided with putting a pea-sized dot of TIM in the center of the CPU's IHS, and then letting your cooler or water block spread it (though there is still a very minute risk of air bubbles, it's rare if you're careful), and will always yield a more even and consistent spread; however the gain in temps between application methods may not always be obvious. Note that with HDT (heatpipe direct touch) coolers like my own Thor's Hammer, the best application method is still a single line between each heatpipe; Benchmark Reviews showed this some time ago with the HDT-S1283 and it's very clear that this yields the best spread with that type of cooler.
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post #7 of 15
Thread Starter 

I used the spreading method on my GPU, that definitely seems like the worst way, so much air gets trapped.
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post #8 of 15
With single core dies I use a dot, with multi-core (physical) dies I bisect the cores with a line.

The even and increasing application of pressure as the block or heatsink is installed leaves a uniform application.

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post #9 of 15
I always use the Pea method.
I don't see any reason to spread the compound over the whole CPU.

Spreading is by FAR the worst method of application.
Its always been highly prone to bubbles and its not only a mess to clean up, but a mess to apply!!
Finally spreading allows for LOTS of user error.. 90 percent of people don't know how much to apply when they spread.

Pea method is guaranteed no bubbles as the compound pushes ALL of the air out from the center of the CPU.
And If you need more of the CPU covered, just use a BIGGER PEA SIZE.




Great videos by Mit Namso! +1
I always use these as examples. :]
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post #10 of 15
Quote:
Originally Posted by Chunky_Chimp View Post
Mit Namso, please keep in mind that thermal paste spreads even further on its own when heated when using the pea/rice in the center method. You can't expect it to provide full paste coverage of the IHS if you apply it and then check the spread without first powering on and stressing the system.
ya I forgot to mention I don't do the manual spread anymore. I do the peasize in the middle and let the pressure take care of the rest. I got better temps that way.
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