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AMD CPU Thermal Paste Application?

post #1 of 7
Thread Starter 
Hi guys smile.gif

Doing my first AMD build and I am wondering if AMD thermal paste application is the same. I am using an AMD Athlon II x4 640 with a Scythe Mugen 2, is the method for AMD similar to the Intel method, being that you put a grain of rice sized thermal paste blob in the middle of the CPU then seat the cooler on top of it and let it spread naturally?

Thanks for any help/advice!

Edit: Paste is NT-H1, Mobo is ASUS M4A88TD-V EVO
Edited by BlahBlahBlah - 12/29/10 at 3:35pm
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post #2 of 7
Yup, not quite the size of a grain of rice in the middle, place the heat sink, start to tighten the latch and wiggle it as it clamps down (or does it use a different type of latch than the regular AMD retention mechanisim? if so, same amount of TIM, just wiggle a little after tightening).
Edited by blupupher - 12/29/10 at 3:39pm
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post #3 of 7
yes, dot in the middle and apply pressure evenly
post #4 of 7
Thread Starter 
Thanks guys, better safe than sorry right?

+repped and going to finish it up!
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post #5 of 7
there's also the x method which guarantees full cpu coverage, not that its needed. [ame]http://www.youtube.com/watch?v=EyXLu1Ms-q4[/ame]
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post #6 of 7
Typical application of TiM is placing a pea sized dot in the middle of the CPU
post #7 of 7
Quote:
Originally Posted by SpeedNuggeT;11821780 
Typical application of TiM is placing a pea sized dot in the middle of the CPU

BB size. Pea size is a bit too much. Found this in a comprehensive TIM testing article.
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