Originally Posted by ehume
This. I managed to mount mine with the mb on the case, but I won't do that again despite good temps. Put the heatsink upside down on a table. Put your mb over it and press down gently. Have a friend screw in the screws.
You can straighten the fins. Markings will be trouble only on the contact plate, and then only in the center. Shallow markings the TIM should deal with (two-grains-of-rice method). The TIM should be applied to the center of the cpu, and not on the heatsink.
What kind of markings, BTW?
idk, i was thinking of lapping the base, not sure yet
markings are white scratches on contact plate. i dont have a camera to do macro shots with, and
i've also reseated my mugen 2 at least 20 times with a case that didnt have the mb hole, so i am pretty efficient using that method.
but, the first time mounting my previous i7 950 into my new case, i used the mb out of tray method that you had suggested. now, i just keep the mb in the case and my gf helps me hold the mugen as i mount it. ive replaced the fan and while doing so, got a closer look to see if the base is making contact with my cpu and it does.
no wobbling either. screws are securely on the 1366 slots, although i can mount it through the 1156 holes.
using high speed yates in push pull setup if that matters. still idles pretty damn high.
debating if i should go wc and i dont think it's the cpu's flatness that is causing the prob. same temps with 2 different i7 cpus (950 and the current 920)Edited by Kick - 12/31/10 at 12:06pm