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Are my temperatures normal? (Water cooled rig)

post #1 of 14
Thread Starter 
Hello all,

I would please like to know if my temperatures are normal. I have a Intel Core i7 965 XE running at stock speeds. I also have two EVGA GTX 480 SC (Core Clock: 725MHz, Shader: 1451MHz, Memory: 1900MHz) cards running in SLI. Both are water cooled with parts supplied by Danger Den.

I am running a continuous loop with two radiators (a Black Ice SR 120 and a 360, both fitted with S-flex fans) and one resevoir. Here are my temps (Celsius):

CPU (max temp reached):
47 (idle)
56 (playing ArmA II, about 33% load)
67 (testing with Prime95, 100% load)

GPUs
40 (idle)
50 (playing ArmA II)
56 (stress testing with ATITool)

Is anyone out there with same hardware getting better temps? Worse temps? Please let me know.

Thanks
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post #2 of 14
Those temperatures aren't exactly good, especially for stock clocks. I would say those temperatures would be good if you were at 4.0 GHz on the CPU and 900 MHz on GPUs, but since you aren't, they are pretty bad. What RPM are those fans? What TIM are you using? How much did you apply? What pump do you have?
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post #3 of 14
Thread Starter 
Quote:
Originally Posted by charliehorse55 View Post
Those temperatures aren't exactly good, especially for stock clocks. I would say those temperatures would be good if you were at 4.0 GHz on the CPU and 900 MHz on GPUs, but since you aren't, they are pretty bad. What RPM are those fans? What TIM are you using? How much did you apply? What pump do you have?
Hmmm, that's what I suspected.

My fans are S-FLEX 120mm running at 1600 RPM, providing 63.7 CFM each.
The pump is a Laing DDC 3.35 to 12 volt (18 Watt Version).
What do you mean by TIM? If you mean thermal paste, I use Artic Silver and I thought I applied a reasonable amount. Not too much, not too little.

Additional information on my cooling system. The loop goes: Pump> Small Radiator>CPU block>GPU block 1>GPU block 2>Big Radiator>Resevoir. I'm using 3/8 inch tubing with Feser 1 coolant.
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post #4 of 14
Quote:
Originally Posted by Infantry1982 View Post
Hmmm, that's what I suspected.

My fans are S-FLEX 120mm running at 1600 RPM, providing 63.7 CFM each.
The pump is a Laing DDC 3.35 to 12 volt (18 Watt Version).
What do you mean by TIM? If you mean thermal paste, I use Artic Silver and I thought I applied a reasonable amount. Not too much, not too little.

Additional information on my cooling system. The loop goes: Pump> Small Radiator>CPU block>GPU block 1>GPU block 2>Big Radiator>Resevoir. I'm using 3/8 inch tubing with Feser 1 coolant.
Did you do the single uncooked rice sized drop right in the middle, I have found that to work best. Are the fans pushing or pulling? What cpu block do you have?
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post #5 of 14
Thread Starter 
Quote:
Originally Posted by PulkPull View Post
Did you do the single uncooked rice sized drop right in the middle, I have found that to work best. Are the fans pushing or pulling? What cpu block do you have?
No, I did not use a rice-sized drop. On the larger block surfaces, I used several rice-sized drops.

The CPU block is an MC-TDX for Intel i7/Nehalem/1366 purchased from Danger Den.

As far as the fans, they are on the outside of the radiators "pushing" air through them.
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post #6 of 14
Quote:
Originally Posted by Infantry1982 View Post
No, I did not use a rice-sized drop. On the larger block surfaces, I used several rice-sized drops.

The CPU block is an MC-TDX for Intel i7/Nehalem/1366 purchased from Danger Den.

As far as the fans, they are on the outside of the radiators "pushing" air through them.
The size of the cpu does not change and that is all you need to put TIM on. Sounds like you may be putting TIM all over the heatsink and not the CPU? A single rice size drop right in the center of the cpu is all you will need regardless of how much the heatsink overhangs the edges of the cpu. If you put multiple dots or drops of TIM on the cpu, when those drops meet as they spread when compressed tiny little air pockets form. May want to try resetting the block with a single small rice sized drop.
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post #7 of 14
Thread Starter 
Quote:
Originally Posted by PulkPull View Post
The size of the cpu does not change and that is all you need to put TIM on. Sounds like you may be putting TIM all over the heatsink and not the CPU? A single rice size drop right in the center of the cpu is all you will need regardless of how much the heatsink overhangs the edges of the cpu. If you put multiple dots or drops of TIM on the cpu, when those drops meet as they spread when compressed tiny little air pockets form. May want to try resetting the block with a single small rice sized drop.
OK, so one rice-sized drop for the entire CPU? Doesn't seem like it will spread far enough to provide adequate coverage.
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post #8 of 14
Quote:
Originally Posted by Infantry1982 View Post
OK, so one rice-sized drop for the entire CPU? Doesn't seem like it will spread far enough to provide adequate coverage.
It doesn't need to cover the entire CPU surface. The actual CPU die is only a small part of the CPU's full size, the rest is just the IHS and thermal contact doesn't really help temperatures all that much.
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post #9 of 14
Quote:
Originally Posted by Infantry1982 View Post
OK, so one rice-sized drop for the entire CPU? Doesn't seem like it will spread far enough to provide adequate coverage.
I promise it will.

This may sound crazy, but let me explain. You don't want TIM between your cpu and heatsink. In a perfect example, there would be 0 gaps and imperfections in both surfaces and they would make complete contact with each other with no TIM needed. That would offer the ultimate in cooling. All you want the TIM to do is to push the air out off the gaps that are going to occur because nothing is perfect. The TIM transfers heat better than air. This is why you only want 1 small drop in the middle. So that as it spreads it pushes the air out of the imperfections in the surfaces. When you have two or more drops, if those drops were to meet at an imperfection (which they will cause the in imperfections are everywhere) the air has nowhere to go and an air pocket is formed.
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post #10 of 14
I'll go with the CPU waterblock.

The DD MC-TDX was good in it's day (arguably one of the best pin array waterblocks) but with newer multicore CPUs it just isn't that great.

The newer designed micro-fin style waterblocks (like those from Heatkiller, the XSPC Rasa, EK etc) are much more efficient and can move the heat better.

To give you an idea of how it compares to one of the better waterblocks atm, the Swiftech XT:
  • the MC-TDX was about equal with the Swiftech Storm Rev2 under load
  • the Swiftech Storm Rev2 runs approx 3C-5C hotter then the Swiftech GTX under load
  • the Swiftech GTX runs approx 5C-8C hotter then the Swiftech GTZ under load
  • the Swiftech GTZ runs around 3C-5C hotter then the current Swiftech XT under load

So your MC-TDX would run somewhere around the 11C-18C hotter then a Swiftech XT under load.

Upgrade your waterblock to one of the following, any one of them will perform a crapload better then the old MC-TDX:
EK Supreme HF
Swiftech XT
XSPC Rasa
Koolance CPU-360
Heatkiller 3 CU
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