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post #9661 of 10523
Quote:
Originally Posted by anubis1127 View Post

Oh, come on, just delid it, and run the block directly on the die. What do you really need an IHS for anyway.

Quote:
Originally Posted by arvidab View Post

Got a 6970 rolling, BWG will perhaps put it in soon.
Was thinking the same, my 3570K have a ~6-7C diff between the hottest and coldest core, reapplied with varying amount of TIM several time and the result were pretty much the same.
You're talking about the socket latch right? tongue.gif The CPU block/cooler takes care of holding the CPU in in the actual socket if you run IHS-less.
I want to delid, mainly for changing TIM, so if I do that I would put the IHS back on too. About running IHS-less on the GTX580, that's a much bigger die, right? So more surface area to spread the heat to the cooling block.


I've been thinking about delidding but Im just not brave enough, lol, i dont have steady hands or another $300 kicking around if I screw it up, which i probably will redface.gif Im happy with the temps now, its a little warmer then I expected to get with the open loop kit, but still much better then the h80 and still well below tj max. Im going to try more tim just for the heck of it and maybe set it up in push pull since I have several spare fans kicking around and see what happens

Going to drop a 780x at the next update for 14-15k points so if I get decent units after I may have another 30k points today thumb.gif
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post #9662 of 10523
Quote:
Originally Posted by TheBlademaster01 View Post

Yeah, I meant the latch. You probably need to remove it to let the die make contact to the block.

Exactly my thinking, with the IHS removed, the height from the PCB will be lower and the block would probably hit the latch if you keep it attached.
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post #9663 of 10523
Quote:
Originally Posted by TheBlademaster01 View Post

No, the socket holds the package in place without the IHS. You need the IHS to make proper contact with the die and WB though. The heat transfer surface of the die isn't that great...

that doesn't change with removing the IHS...

maybe you should re-lid / re-tim and use indigo xtreme? opinion?
 
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post #9664 of 10523
Quote:
Originally Posted by arvidab View Post

Exactly my thinking, with the IHS removed, the height from the PCB will be lower and the block would probably hit the latch if you keep it attached.

I'm pretty sure it would have been mentioned in one of the IB delidding posts/guides if there was any interference issue with the CPU mounting mechanism.
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post #9665 of 10523
Quote:
Originally Posted by u3b3rg33k View Post

that doesn't change with removing the IHS...
maybe you should re-lid / re-tim and use indigo xtreme? opinion?

Of course it does. The block makes more contact with the IHS than with the die on itself. If you remove the IHS, the waterblock will not make full contact. If you properly apply a thin layer of tim between the IHS and die, it will make no difference and you'll have a proper mount.
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post #9666 of 10523
Quote:
Originally Posted by TheBlademaster01 View Post

Of course it does. The block makes more contact with the IHS than with the die on itself. If you remove the IHS, the waterblock will not make full contact. If you properly apply a thin layer of tim between the IHS and die, it will make no difference and you'll have a proper mount.

The thermal performance will always be better having the water block mounted in direct contact with the CPU die.
The water block makes the same amount of contact with the CPU die as the IHS would have, and heat transfer is more efficient because there isn't the extra layer of TIM, and extra thickness of metal, between the CPU die and the water.

Just look at any threads where people talk about the results of deliding their CPU.
In all cases there is a significant improvement in cooling, and I've not seen a single report of clearance issues with the CPU mounting mechanism.
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post #9667 of 10523
What an interesting turn of events rolleyes.gif Stanford forceing core 2.25 and 762x on everyone mad.gif Maybe their putting qrb on everything into effect biggrin.gif

Another decent day at 30k points biggrin.gif Today was almost identical to Monday for me, a few 8027s, followed by a 780x, and finishing with more 8027s. The whole team did great today, were in 2nd thumb.gif


The fans on the dedi were getting really loud the last week or so, like the fans were working overtime, so I shut it down tonight for 5 minutes for a well deserved heavy dusting. I even removed the fans from the radiator. Im surprised it wasnt overheating, the radiator was 100% packed full of dust, i could see no dailight between the fins, when i blew it out my apartment went cloudy for a few minutes biggrin.gif When i put it back together i replaced the low static pressure scythe slipstreams with a pair of stock corsair fans (total of 4 corsair fans) and fired her up. Now its silent and much cooler.

I know people complain about how noisy the stock corsairs are, i did too when i had my h80 in the main rig, but in a caseless setup like my dedi, they are virtually silent. They can move some serious are too biggrin.gif
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post #9668 of 10523
Quote:
Originally Posted by Caleal View Post


The thermal performance will always be better having the water block mounted in direct contact with the CPU die.
The water block makes the same amount of contact with the CPU die as the IHS would have, and heat transfer is more efficient because there isn't the extra layer of TIM, and extra thickness of metal, between the CPU die and the water.
Just look at any threads where people talk about the results of deliding their CPU.
In all cases there is a significant improvement in cooling, and I've not seen a single report of clearance issues with the CPU mounting mechanism.

 

About the latch:

 

http://www.techpowerup.com/forums/showpost.php?p=2775935&postcount=94

 

I was not talking about how it should be a better conductor. My old post was not properly formulated. I meant because the surface of the IHS makes full contact to the WB and the die doesn't, it won't make that much of a difference taking the hit of a second medium conducting the heat. (w/ IHS, greater cooling surface vs. higher thermal conductivity per area on silicon w/o). I would still advise people to use the IHS though. Maybe you get a ~3*C win but you expose the PCB veins and have a chance of scratching the silicon (there are AMD R700, R800, Cayman stories of this). Also, without the socket latch you need to watch the contact points on the CPU since that is an easy way to short the CPU out. There's a reason why SoC manufacturers put an IHS on their products tongue.gif

 

It's not really worth it IMO. Delidding is dangerous already but running it without IHS doesn't seem like it is worth the risk.

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post #9669 of 10523
The main rig picked up a 7021 so I was hoping the dedi would pick one up soon, but instead it picked up a 7808 frown.gif

BTW, the 3770k in the main rig is running 65-70c on 7021 on 6 cores, vs 58-62C on everything else on 6 cores
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post #9670 of 10523
Quote:
Originally Posted by TheBlademaster01 View Post

About the latch:

http://www.techpowerup.com/forums/showpost.php?p=2775935&postcount=94

I was not talking about how it should be a better conductor. My old post was not properly formulated. I meant because the surface of the IHS makes full contact to the WB and the die doesn't, it won't make that much of a difference taking the hit of a second medium conducting the heat. (w/ IHS, greater cooling surface vs. higher thermal conductivity per area on silicon w/o). I would still advise people to use the IHS though. Maybe you get a ~3*C win but you expose the PCB veins and have a chance of scratching the silicon (there are AMD R700, R800, Cayman stories of this). Also, without the socket latch you need to watch the contact points on the CPU since that is an easy way to short the CPU out. There's a reason why SoC manufacturers put an IHS on their products tongue.gif

It's not really worth it IMO. Delidding is dangerous already but running it without IHS doesn't seem like it is worth the risk.

Theres probably no Si exposed, IHS or not. At least all memory is packaged and is what you see soldered to the stick or chip. Si would be more like the bright rainbow color you see when Intel announces new process node and they hold up a wafer. SI oxidizes anyway, which would be horrible for thermal transfer.

I've seen a few Duron/Athlon CPUs chipped before and still work. Si was never exposed, just the packaging on top.
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