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Cooling Open-style Test Bench Case

post #1 of 3
Thread Starter 

I just ordered a new setup with the MyOpenPC DOMA Pro PCI case, which is like a test-bench open style case, and trying to figure out how to do the cooling of the CPU here. Pics of the case can be found on Amazon:


Brief aside for the logic of why I think I only need to worry about CPU cooling:
I'm a bit rusty on my thermodynamics, and while I know standard cooling conventions would dictate lots of airflow with cold air coming in the front of a case and hot air going out the exhaust in the back, I think this open style won't follow the same rules. I believe based on the open air, airflow actually should matter less - more important would be the temps of the surrounding environment. That said, I think there should be an emphasis on drawing hot air away from the case and not clustering up near the back where there is a panel - primarily on the CPU only. GPU and memory should be satisfied by ambient temps (I think) so long as there is no increased hot air blown on to the components by the CPU.

Back to my question:
I have a hyper master 212+ I plan to install on the CPU with two fans, but am trying to figure out what direction to set up the push-pull. Should I pull from the back of the case (where there is not much breathing room it seems) and push out the front where all the open air is? Or should I pull from the front where all the open air is and push out the back, which looks like it might heat up some of my other components?

Appreciate any help if people have it
    
CPUMotherboardGraphicsRAM
i5-2500k AsRock P67 Extreme4 Asus Radeon HD 6850 PNY XLR8 4GB DDR3 1600 CAS8 
Hard DriveOSMonitorKeyboard
Samsung Spinpoint F3 1TB Windows 7 Ultimate Vizio VF550M Microsoft Wireless Keyboard 6000 v3 
PowerCaseMouse
OCZ ModXStream 600W MyOpenPC DOMA Pro PCI Microsoft Wireless Mouse 2000 
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CPUMotherboardGraphicsRAM
i5-2500k AsRock P67 Extreme4 Asus Radeon HD 6850 PNY XLR8 4GB DDR3 1600 CAS8 
Hard DriveOSMonitorKeyboard
Samsung Spinpoint F3 1TB Windows 7 Ultimate Vizio VF550M Microsoft Wireless Keyboard 6000 v3 
PowerCaseMouse
OCZ ModXStream 600W MyOpenPC DOMA Pro PCI Microsoft Wireless Mouse 2000 
  hide details  
Reply
post #2 of 3
I'd say pull front and push out back, heat rises, so I wouldn't worry about pushing air towards the back just hanging around there, it'll naturally move away from the other components.
TJ-08
(14 items)
 
   
CPUMotherboardGraphicsRAM
3570k ASRock Z77 Extreme-4M Saphire 6770 G.Skill Sniper 2x4gb 
Hard DriveHard DriveOptical DriveCooling
Samsung 830 128gb WD Black 640gb Broken Asus H60 Push/Pull 
OSMonitorKeyboardPower
W7 Pro Acer 23 / Panasonic 720 Logitech Corsair 750tx 
CaseMouse
TJ-08e Logitech 
CPUMotherboardGraphicsRAM
i7 2630QM Lenovo HM65 Socket 988B Nvidia GT555M G.Skill 1333 8GB 
Hard DriveOS
Intel 320 W7 Pro 
  hide details  
Reply
TJ-08
(14 items)
 
   
CPUMotherboardGraphicsRAM
3570k ASRock Z77 Extreme-4M Saphire 6770 G.Skill Sniper 2x4gb 
Hard DriveHard DriveOptical DriveCooling
Samsung 830 128gb WD Black 640gb Broken Asus H60 Push/Pull 
OSMonitorKeyboardPower
W7 Pro Acer 23 / Panasonic 720 Logitech Corsair 750tx 
CaseMouse
TJ-08e Logitech 
CPUMotherboardGraphicsRAM
i7 2630QM Lenovo HM65 Socket 988B Nvidia GT555M G.Skill 1333 8GB 
Hard DriveOS
Intel 320 W7 Pro 
  hide details  
Reply
post #3 of 3
Back to Front, get the hot air away from the case and components....
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