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Enough thermal paste? - Page 4

post #31 of 36
Quote:
Originally Posted by Nikkopo View Post
I put a little dot, big like a uncooked rice corn.
Why so stingy? Use the pea method plus some. This "grain of rice" nonsense is rubbish. If you are literally only putting on a squirt the size of a grain of rice are you also clamping down your HSF to the point of snapping your mobo? Because that's the only way that little of paste is going anywhere.

Pea in the middle and some very small dabs in the corners.
    
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post #32 of 36
Quote:
Originally Posted by ryanrenolds08 View Post
and some very small dabs in the corners.
What
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post #33 of 36
Quote:
Originally Posted by ryanrenolds08 View Post
Why so stingy? Use the pea method plus some. This "grain of rice" nonsense is rubbish. If you are literally only putting on a squirt the size of a grain of rice are you also clamping down your HSF to the point of snapping your mobo? Because that's the only way that little of paste is going anywhere.

Pea in the middle and some very small dabs in the corners.


nice! thick with air pockets,im liking your style........

however,i just pre-warm the TIM before application,spreads a lot better..
Edited by B NEGATIVE - 1/29/11 at 9:30am
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post #34 of 36
Radio Shack = AS5 and AS 2 Part cleaner... its high, but its radio shack... their everywhere...

That said, there are 2 components when using TIM, the least amount the better, the more pressure between mounted surfaces the better. Every persons setup is different, chip to brick (stock cpu to stock cooler) I like the bb method, lapped to lapped, a razor blade and spread... especially on Nvida GPUs, as they like to laser etch there chips, and that etching must be filled.

If ya decide to spread this can be a trick too, as ya wanna go at it like your "rolling" the surfaces together, this may be hard if your cooler has 4 sticks and your going down on it. Think prepping a slide for a microscope, and you get the idea.

Air gaps... well on the average, and on a very microscopic level, surfaces per given space make about a 2% surface area contact. Lapped in Greased, ups that a good deal, but on the micro/nano level, it still looks like mountain peaks hitting mountain peaks.

Heck lots of stock coolers come with thermal pads, and those things are pretty bad, but the clipping mechanisms make enough pressure to get a good contact. In some cases, its not at all that bad, considering how much of a concave many of the chips (at least the ones I have seen) have. That makes a big difference too. Food for thought anyhow.
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post #35 of 36
Quote:
Originally Posted by B NEGATIVE View Post
nice! thick with air pockets,im liking your style........

however,i just pre-warm the TIM before application,spreads a lot better..
Well it may not be popular but my overclocks across all my systems coupled with low temps begs to differ.

Ah, well, to each his own. My works for me and I am sure your way works for you. Just giving the OP my .02 like the rest of you.
    
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post #36 of 36
i totally agree! what works with one may not work with another,thats why suggested two glass tiles to see what kinda of spread he is getting.
OP,go to AMD.com and see what they suggest as your application method,i think they recommend line anyhow. Once clean,do not touch the mating surfaces with your skin,the grease you prints leave is detrimental to TIM performance. less is more and pressure is king!
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