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Lapped AMD Phenom II 965 + lapped stock heatsink. Good bye thermal paste! - Page 4

post #31 of 62
Thread Starter 
Quote:
Originally Posted by Riou View Post
I get temps of 25C idle and 47C LinX load with an unlapped stock AMD cooler and unlapped AMD 965 BE and MX-2.

You need paste.
What are your ambient temps? Cause mine are around 24C (75F).
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post #32 of 62
He will need paste, if he wants to push his clocks at all, but since he has good temperatures now, I don't believe anyone has shown any real reasoning to dispute that his current non-tim setup with both sides lapped is actually providing sufficient cooling right now.
Paste is there to fill the gaps and imperfections in both the heatsink and the CPU heatspreader, I don't doubt that adding a small amount of TIM to his current setup would improve things further. Lapping accomplishes a lot (but not all) of what TIM is there to do. It's now only on the microscopic level that he has surface imperfections, thus only a small amount of TIM is needed to improve temperatures even further.
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post #33 of 62
Thread Starter 
Quote:
Originally Posted by Artikbot View Post
And its nice that you tried to get the most outta it.

You got some practice aswell, and that does count for the next heatsink you lap.

But yes, add some paste please. That'll drop at least 10ºC. Be sure of it.
That was the other reason I did this is for practice. I plan on buying a new heatsink before the summer heat comes so if I messed up on this heatsink it'd just give me a reason to get a new one now instead of later. Then I decided to lap the CPU after, by the naked eye, being able to see it's concave and knowing that I plan on upgrading to a Phenom II X6 soon too.
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post #34 of 62
[QUOTE=Soggysilicon;12249405
That much is true, but diamond conducts heat better than metal...
Thermal conductivity
(W/m K)*
Diamond ... 1000
Silver 1.01 406.0
Copper 0.99 385.0
Gold ... 314
Brass ... 109.0
Alum 0.50 205.0[/QUOTE]

Diamond based TIM and solid diamond would vary.
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post #35 of 62
Thread Starter 
Quote:
Originally Posted by allikat View Post
He will need paste, if he wants to push his clocks at all, but since he has good temperatures now, I don't believe anyone has shown any real reasoning to dispute that his current non-tim setup with both sides lapped is actually providing sufficient cooling right now.
Paste is there to fill the gaps and imperfections in both the heatsink and the CPU heatspreader, I don't doubt that adding a small amount of TIM to his current setup would improve things further. Lapping accomplishes a lot (but not all) of what TIM is there to do. It's now only on the microscopic level that he has surface imperfections, thus only a small amount of TIM is needed to improve temperatures even further.
This is exactly what I have been trying to explain. Right now I don't plan on overclocking this CPU again, if I do then me re-lapping the CPU heatsink better either drop my load temp 10+C or I'm going to buy some IC Diamond. Yes to our current technology it is impossible to make a 100% perfect flat surface, and I doubt that'll change any time soon, or at all, but this forum is for pushing the limits of computers, is lapping a CPU and heatsink not trying to push the limits of... flatness so you can push the computer farther? Lol
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post #36 of 62
When you do apply your thermal paste, DO NOT brush it on, or FLATTEN out with a razor blade. The absolute best way to apply it is simply create a single dot about the size of a B.B. all other methods tend to create air bubbles, and raise temps
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post #37 of 62
Quote:
Originally Posted by mikelkassner View Post
what are your ambient temps? Cause mine are around 24c (75f).
19-20 c.
post #38 of 62
Thread Starter 
Quote:
Originally Posted by Asustweaker View Post
When you do apply your thermal paste, DO NOT brush it on, or FLATTEN out with a razor blade. The absolute best way to apply it is simply create a single dot about the size of a B.B. all other methods tend to create air bubbles, and raise temps
Thanks for the tip, I've never applied thermal paste before, last CPU I had to deal with thermal paste was my AMD K6 500MHz and that thing is so slow it didn't need thermal paste.
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post #39 of 62
Thread Starter 
Here's the pics;
Before lapping the heatsink


After


And after lapping the CPU


Then the BIOS temps


Idle temps in Windows 7 Ultimate 64bit


And load with prime95


Sorry for the fuzzy pictures, camera phone doesn't like anything closer than 2feet away. Over all temps could be better, but they could be a LOT worse, so I'm happy for now.
Edited by MikelKassner - 2/3/11 at 5:27pm
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post #40 of 62
Very pretty, good job good luck with more in the future
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