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Lapped AMD Phenom II 965 + lapped stock heatsink. Good bye thermal paste! - Page 5

post #41 of 62
Quote:
Originally Posted by BlackHoleSon View Post
Diamond based TIM and solid diamond would vary.
Thats the gimmick with artic silver, and why many of there models have "cook times", the polymer or active ingredients setup the diamond nano tubes... or so it is said... I figure just little carbon chains with diamond/silver that go from surface to surface... gatta figure its better than nuthin or air... Good pressure should "squeeze out" from the metal to metal contact... is it better or worse? Its maybe a wal-mart solution (any theory that is only slightly better than an alternative). A couple percent.

Quote:
Quote:
Originally Posted by Asustweaker
When you do apply your thermal paste, DO NOT brush it on, or FLATTEN out with a razor blade. The absolute best way to apply it is simply create a single dot about the size of a B.B. all other methods tend to create air bubbles, and raise temps

Thanks for the tip, I've never applied thermal paste before, last CPU I had to deal with thermal paste was my AMD K6 500MHz and that thing is so slow it didn't need thermal paste.
here page 1:

Quote:
Originally Posted by me
Artic Silver 5, (I like to use a razor blade on lapped surfaces), you wont need much but even lapped the contact area between surfaces...
 
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post #42 of 62
Thread Starter 
UPDATE
Ordered some IC Diamond and will post updated temps with it on once it arrives. Though it may take a lil because I accidentally ended my ZIP code on the mailing address with a 2 instead of 3 so I gotta call tomorrow to correct that. Also will be working on finding a way to have a controlled testing environment to test temps in, will see how that goes as I haven't had much ideas yet lol. Being OCD, ftw!
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post #43 of 62
Quote:
Originally Posted by scyy View Post
There are still going to be microscopic areas that are not making contact which you would want TIM to fill.

Absolutely correct.
Now let's work this through:

Why would this be a problem?
post #44 of 62
Thread Starter 
Okay as far as this thread goes this should be my last update. First I want to say that my CPU fan, thanks to it getting jammed on a piece of packing foam and me not noticing, partially burned itself out and now can only reach 4000RPMs instead of it's usual 6000RPMs, however it's idle speeds are still the same so I can update the idle temps accurately.
As seen before the idle temp with lapped CPU and heatsink with NO TIM was 35c, the idle temp now with lapped CPU and heatsink with IC Diamond is 32c. So far not impressive enough for me to think the $20.90 I spent on this IC Diamond was worth it.
Now the load temps with lapped CPU and heatsink with NO TIM and 100% CPU fan was 59c, now with lapped CPU and heatsink with IC Diamond and CPU fan running at ~65% is... 60c. So in all honesty I dunno. xD To me it looks like the difference between no TIM and the highest quality TIM available is no more than 5c but I can't prove that with a now mentally retarded fan since load/stress temps are where the real differences are shown. Anyways here's the pictures.
Idle


And stress


If all goes well I will buy a new heatsink by the end of the month along with new high quality fan(s) to go on it and redo this same testing to find out the 100% truth of, if done properly, does a lapped CPU need TIM. Hope you all enjoyed my first lil experiment!
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post #45 of 62
I would try the test with the lid off the case and see what you get.
Your temps are awfully high.
My nephew's computer has a 940 BE processor running at 3.6 GHz [1.41 volts ] and it never goes above 42 C at 75% load.
That's with a Zalman CNPS 9700 cooler in a CM 832 Stacker case.
I'm guessing the cooler is under rated for the job and you don't have enough airflow.
BTW: You need paste.
Now matter how well you lap,you can't beat the laws of physics.
post #46 of 62
Quote:
Originally Posted by jacksknight View Post
umm no.. Always use thermal paste!
this!
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post #47 of 62
Thread Starter 
Quote:
Originally Posted by The Radius Kid View Post
I would try the test with the lid off the case and see what you get.
Your temps are awfully high.
My nephew's computer has a 940 BE processor running at 3.6 GHz [1.41 volts ] and it never goes above 42 C at 75% load.
That's with a Zalman CNPS 9700 cooler in a CM 832 Stacker case.
I'm guessing the cooler is under rated for the job and you don't have enough airflow.
BTW: You need paste.
Now matter how well you lap,you can't beat the laws of physics.
It's the stock cooler and their is no computer case, it sits on my desk on a motherboard tray.
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post #48 of 62
The correct way to do this is using TIM. It doesn't matter if both your cpu and heat sink are both lapped. Without TIM there is nothing to transfer heat from CPU to the HS. It doesn't just fill in the cracks it acts as a medium to transfer heat.
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post #49 of 62
Quote:
Umm no.. ALWAYS USE THERMAL PASTE!
What he said.

This should be a no brainer. Just because it's "mirror finish ooooooo" doesn't mean it is smooth or FLAT. You can't see the microscopic valleys, but trust me they're there.
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post #50 of 62
Quote:
Originally Posted by Xyxyll View Post
What he said.

This should be a no brainer. Just because it's "mirror finish ooooooo" doesn't mean it is smooth or FLAT. You can't see the microscopic valleys, but trust me they're there.

Eeyup....valleys full of air.
The big question is why would air be worse at transfering heat than metal filled paste?
Ultimately,every home computer is air cooled..unless you're using a geothermal loop.
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