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Auxiliary heat from Water-cooled components?

post #1 of 3
Thread Starter 
Despite the heat coming off from the radiator, I was wondering in a scenario of a very small case, where GPU (Likely looking when I do the build around the time Haswell is release) ATI 9990 or whatever dual GPU model is released at the time, CPU, and North/South Bridge are cooled, though I heard something about Haswell integrating those or something of the sorts, not sure though.

The case obviously would have I'd imagine enough passive air moving through it to manage most of the auxiliary heat given for what I'm thinking for a rad, 3x 120MM (25MM thick) Push config, but I'll place whatever fits at the bottom of the custom case though.


I just want to know any high alerts for possible over heating situations on various areas that I may not be aware of, that needs airflow to compensate, under motherboard etc?

VRAM on the backside of GPU, etc.
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post #2 of 3
Yeah the VRAM should be cooled. Also mosfets and voltage regulators on the motherboard and GPU.

As long as you have some air flowing through it, you should be okay...

Just think of it like this. If the manufacturer put something on a chip, it needs to be cooled. If not it can usually burn as far as we care.
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post #3 of 3
Thread Starter 
Just going to toss this one back up to see if anyone else has some thoughts on it.

Thanks Finny for the input btw +Rep.

Just want to know some specifics if I need a forced airflow passing over components, such as RAM/VRAM (Likely will add a RAM cooler anyway)

And if from WC'd components what is the heat let off in a low-medium airflow case.
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1TB WD Blue 240gb Kingston SSDnow V300 x2 420mm Custom EK Loop Windows 10 64bit Home 
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42" Samsung TV + 23" Dell pro series Logitech G710+ Corsair HX750 Bequiet Dark base 900 pro 
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1TB WD Blue 240gb Kingston SSDnow V300 x2 420mm Custom EK Loop Windows 10 64bit Home 
MonitorKeyboardPowerCase
42" Samsung TV + 23" Dell pro series Logitech G710+ Corsair HX750 Bequiet Dark base 900 pro 
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