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Phenom II 965 Tempature Question - Page 2

post #11 of 18
Thread Starter 
ok i dusted my comp out and that reduced my heat idle by 8C and now my load doesn't exceed 50C. when i first applied the pea sized glob of paste i was instructed to move it around to make sure it covered the entire surface as best as possible. was that a mistake? if i reseat the heatsync should i use only a rice size portion and should i move it around at all?
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post #12 of 18
The amount of TIM to use is going to vary from person to person. Not everyone applies it the same way, some people put it on the headsink, some put it on the processor, some spread it out before seating, some spread it while seating, some don't even spread it and let the pressure of the heatsink move the TIM around. Just remember, the more surface area you get TIM on, the more heat transfer ability there is going to be.

If you ask me, experiment for yourself and find what works best for you. I personally like to spread it around on the CPU's surface using the tip of the TIM tube, then put the heatsink on. It must work fine, because I idle at 30C and load at 50 on my 965 and I've never had a problem with temps in the past.
Edited by SectorNine50 - 3/10/11 at 12:43am
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post #13 of 18
Thread Starter 
ok but if that's the case shouldn't more be better? "the more surface area you get TIM on, the more heat transfer ability there is going to be." if that were true without bounds shouldn't i want a layer of the stuff?
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post #14 of 18
To an extent.

What I mean by more surface area is contact with the heat spreader on the CPU and heat sink. NOT how thick the TIM is on the surface. By making it so that the TIM touches the entire heat spreader on the CPU, you are maximizing the area in which the heat can be transferred into the heatsink.

While TIM is a great thermal conductor, the shorter the route to the heatsink, the better. Like stated above, the TIM is meant to maximize surface area from the CPU to the heatsink. Use enough to cover the whole surface of the CPU, but not so much that it's gooping out of the sides (that would be a waste!). One of the biggest problems with asking for how much to add, is that each heatsink and CPU heat spreader can be greatly different, requiring different amounts. The Phenom II stock heat sink has a LOT of surface area, and in my experience, required a little more compound than I used on my previous Intel.

Don't stress too much over it, really. Unless you are going for top clock, your TIM application technique will really just be trivial, you'll see bigger differences in the quality of TIM.

If you'd like to do more reading, I found this interesting:
http://benchmarkreviews.com/index.ph...1&limitstart=4

Goes through the different application techniques on different style coolers.
Edited by SectorNine50 - 3/10/11 at 2:22am
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post #15 of 18
Thread Starter 
alright, thanks for the help man.
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post #16 of 18
FWIW, although you seem to be moving in the right direction, my 965 idles around 6c above ambient.

In S.E. Asia, that means mid 30s in the morning and high 30s in the afternoon. It never gets above 45c - that's running prime and furmark at the same time. Cable management and altering the fan layout dropped my temps by 5c.


Any idea what your ambient temps are?
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post #17 of 18
yeah it's pretty much your personal preference, i like to spread it with a tmobil used gift card, i like to spread it so it's completely covered and then spread thin. my temps are pretty good,
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post #18 of 18
i just changed my white thermal paste to the grey stock coolermaster paste that comes with the n520 and before (plus i have the h50) the temps were @ 51 c and now the max is 45 c!
Edited by tha808evangelist - 3/10/11 at 7:59pm
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SSD: Ocz agility 2 40 HD: western digital caviar 2 samsung dvd-r Corsair H50 Push/Pull windows 7 32-bit 
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