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**The best way to apply thermal paste on an i7 with waterblock**

post #1 of 6
Thread Starter 

So I have been wondering about this subject for a long time.
And in my experience everbody has their own way of doing it.

Some like to just apply a dot.
Others spread the paste like butter on a toast.
And again others do the cross , triangle or star method.

I personally think that especially for i7 therefor multicore cpus it is better to use the line method.
The line of thermal compound should be placed parallel to the gpu , because that way it has perfect conductivity right above the heatspreader and other areas that do not require as much thermal compound will be spared,if applied correctly it should look like an oval.
As stated by Linus Sebastian "Less is more" because the paste will have better conductivity and not be impedeted by overflowing over the sides.

That is why spreading the compound all over the block could result in a disprovment of tempretures.

Watch here at 05:00 you can see the thermal compound appliance on the i7.


Edited by Kung Pow - 3/18/11 at 7:41am
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post #2 of 6
Why not? surface of the block is the same.
    
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post #3 of 6
Same technique applies to water-cooling blocks. I use the pea-size dot method.
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post #4 of 6
There is nothing special about water cooling versus air cooling when it comes to the application of thermal compound. There really is no wrong technique for applying thermal compound, provided it ends up covering most of the surface area of the cpu without squishing out the sides.
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post #5 of 6
ive gone usually with the pea sized method but feel that the line method is good like he said on a quadcore, makes sense to make sure its a bit more spread out
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post #6 of 6
Thread Starter 
Yeah Line Method is the best for i7
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