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post #2761 of 5154
Quote:
Originally Posted by Recipe7 View Post
Bump. Anyone able to help me out?
Here is a good dis-assembly video to help you out:



When I re-apply TIM to my cards I do it just like a CPU and spread and even thin layer over the whole heat spreader like this:



Heres a good tidbit from the EVGA forums before you go scraping it off:

Quote:
The stock TIM on the 5xx series is Shin Etsu X23. It's one of the best out there. If you're going to replace it, do not replace it with a dumpy TIM.

I would recommend replacing with Shin Etsu X23 or G751 or IC Diamond. I would no longer recommend using AS5.

You mentioned temps in the 90s but nothing about your fan speed. What are you temps when you set the fan to 100%? That's a better baseline than auto fan.

I've noticed virtually no difference between Shin-Etsu X23, G751, or IC Diamond in terms of reducing GPU temperatures. They all seem to run within 1-2*C of each other. Why? Because they're the best.
post #2762 of 5154
I would have to advise against spreading the TIM like in the video above. The application (X) was fine, but by slapping your finger all over it you're going to introduce air pockets which will hinder the heat transfer.

If you absolutely must spread it, use an old credit card. Otherwise, apply the TIM in the shape of an X as above, then bolt the fan assembly back on. Job done.
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post #2763 of 5154
Quote:
Originally Posted by Smo View Post
I would have to advise against spreading the TIM like in the video above. The application (X) was fine, but by slapping your finger all over it you're going to introduce air pockets which will hinder the heat transfer.

If you absolutely must spread it, use an old credit card. Otherwise, apply the TIM in the shape of an X as above, then bolt the fan assembly back on. Job done.
Air pockets? Seriously? With two flat pieces bolted together? Many of the higher end TIM compounds do not spread well at all with pressure because of the thickness. Using a credit card may work, or some of the kits come with little plastic spreaders, but there is nothing wrong with using your finger.
post #2764 of 5154
Quote:
Originally Posted by Scorpion49 View Post
Air pockets? Seriously? With two flat pieces bolted together? Many of the higher end TIM compounds do not spread well at all with pressure because of the thickness. Using a credit card may work, or some of the kits come with little plastic spreaders, but there is nothing wrong with using your finger.


That is a picture of a sedimentary rock formed under tremendous pressure. Yet it's aerated.

I don't want to be pedantic mate but yes, it can happen!
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post #2765 of 5154
Quote:
Originally Posted by Smo View Post
That is a picture of a sedimentary rock formed under tremendous pressure. Yet it's aerated.

I don't want to be pedantic mate but yes, it can happen!
I don't think that has anything to do with this, given there is four sides of the heat spreader for air to escape on (not that there will be any to begin with). A simple google search will tell you your spreading method has to change depending on the consistency of the TIM, thick = manual spread, thin = weight spread.

If you try to weight spread the thick stuff its just going to be a blob in the middle and act as an insulator since it will likely be too thick.
post #2766 of 5154
Thank you both for your advice. I will take everything into consideration. rep for you both.
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post #2767 of 5154
you can look at this manual for EK waterblocks. i did like they said and having still damn less than 40* under load on both my cards (count OCed 2600K too, they're all in one circuit)
post #2768 of 5154
Proof
So as you can see in my proof photo, I seem to have a pretty good system, but I can't find any 3dmark scores of identical systems that are anywhere near as low as mine. Any ideas?
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post #2769 of 5154
Here are the application notes for IC Diamond, my TIM of choice. I've used Gelid, Shin Etsu, AS5, MX-4, and ICD and it's IMO the thickest of the above TIMs.

I don't believe the application should be varied by thickness, but rather by the TIM's solid:solvent ratio. Those with less solvent must be spread by pressure whereas those with more can be manually spread.

Also, I wouldn't repaste an EVGA 5XX series due to the quality of the paste used. When I blocked my card I was actually impressed by the quality of the paste and the nearly perfect amount used. Maybe my card was an exception, but why change something for the same or maybe 1-2* difference? The quality of the application alone can make it worse even if you go up a level in TIM.

ETA: Just saw the card in question is an ASUS. I'd probably repaste it
I vote for IC DIamond
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post #2770 of 5154
More great info, thanks MKHunt and Wogga.
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