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Lapping a 1090T + Swiftech Apogee XT

post #1 of 9
Thread Starter 
I'm going to be recieving a EK-FB ASUS Crosshair 4 - Acetal + Nickel in about 2 weeks. I'm going to have to remove my whole motherboard to do this and draining my whole system.

So I though about "Lapping", specifically my 1090T and Apogee XT. I've been reading and watching video's on lapping. The CPU seems straight forward, but i've read that the Apogee XT has a bow to it to allow for a better contact with the CPU (which is never flat) in the key middle area of the block.

If I were to lap my CPU, would it beneficial to also lap my water block?

I know some of you are going to say "NO don't wreck your CPU". Weighing the pros and cons, but a 3-5c drop in cpu temp would allow me to push my overclock even higher. So it's going to happen.
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post #2 of 9
You can get the 3-5c drop just buy using indigo extreme.
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post #3 of 9
Thread Starter 
Quote:
Originally Posted by tsm106 View Post
You can get the 3-5c drop just buy using indigo extreme.
I have some Shin-Etsu G751 that i'm going to use...
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post #4 of 9
Quote:
Originally Posted by huhh;12952094 
I have some Shin-Etsu G751 that i'm going to use...

if you gonna lap you cpu then why won't you use Shin-Etsu X23-7783D it should give you better result on that surface then G751 which is more for rough surface

also, indigo is not a conventional paste so you should be able to get much bigger temp drop then with any other tim
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post #5 of 9
Quote:
Originally Posted by huhh View Post
So I though about "Lapping", specifically my 1090T and Apogee XT. I've been reading and watching video's on lapping. The CPU seems straight forward, but i've read that the Apogee XT has a bow to it to allow for a better contact with the CPU (which is never flat) in the key middle area of the block.

If I were to lap my CPU, would it beneficial to also lap my water block?
My EK Supreme HF has a little bit of a bow to it, but it lays down flat against my lapped CPU when I tighten it down. It is the o-ring between the top and the jet plate that causes the base to bow, and the o-ring gets compressed as the block is tightened down on the CPU.

The Apogee XT likely does the same thing.
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post #6 of 9
Thread Starter 
Quote:
Originally Posted by Abell2000 View Post
if you gonna lap you cpu then why won't you use Shin-Etsu X23-7783D it should give you better result on that surface then G751 which is more for rough surface

also, indigo is not a conventional paste so you should be able to get much bigger temp drop then with any other tim

Can't find any Shin-Etsu X23-7783D in Canada and getting it from the USA would cost $20-30 in shipping.

Quote:
Originally Posted by Caleal View Post
My EK Supreme HF has a little bit of a bow to it, but it lays down flat against my lapped CPU when I tighten it down. It is the o-ring between the top and the jet plate that causes the base to bow, and the o-ring gets compressed as the block is tightened down on the CPU.

The Apogee XT likely does the same thing.
I'm worried about having a copper IHS exposed and having that bow push down on the CPU Die.
Edited by huhh - 3/31/11 at 7:37pm
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post #7 of 9
Quote:
Originally Posted by huhh View Post
I'm going to be recieving a EK-FB ASUS Crosshair 4 - Acetal + Nickel in about 2 weeks. I'm going to have to remove my whole motherboard to do this and draining my whole system.

So I though about "Lapping", specifically my 1090T and Apogee XT. I've been reading and watching video's on lapping. The CPU seems straight forward, but i've read that the Apogee XT has a bow to it to allow for a better contact with the CPU (which is never flat) in the key middle area of the block.

If I were to lap my CPU, would it beneficial to also lap my water block?

I know some of you are going to say "NO don't wreck your CPU". Weighing the pros and cons, but a 3-5c drop in cpu temp would allow me to push my overclock even higher. So it's going to happen.

Do them both.
post #8 of 9
Quote:
Originally Posted by huhh View Post
I'm worried about having a copper IHS exposed and having that bow push down on the CPU Die.
The CPU die is soldered to the IHS, and the IHS is thick enough that removing a few thousandths of an inch while lapping it won't make it more likely to bend IMO.

Now if you want crazy, there are people who desolder the IHS from the die, or just sand right through it till they get to the die, and mount the water block in direct contact with it.
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post #9 of 9
Thread Starter 
Quote:
Originally Posted by Caleal View Post
The CPU die is soldered to the IHS, and the IHS is thick enough that removing a few thousandths of an inch while lapping it won't make it more likely to bend IMO.

Now if you want crazy, there are people who desolder the IHS from the die, or just sand right through it till they get to the die, and mount the water block in direct contact with it.
Yeah I'm not that crazy.
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