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[SA] AMD chides Global Foundries in a cryptic release - Page 2

post #11 of 21
Quote:
Originally Posted by Toransu View Post
I get the feeling that this'll mean the end of "unlockable" processors, since they're not taking any "bad" chips to be reborn into dual/quad/(most possibly)hexa-core processors.
NOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOOO !

That is all.
post #12 of 21
Maybe its a way to get Global back on there toes on chip production. It they have gotten sloppy it would be beneficial to AMD to go production based. People and company's work better and more efficiently when there pay is dependent on performance.
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post #13 of 21
I hope this is true.
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post #14 of 21
If they're buying per die instead of wafer that's bad news.

Manufacturers purchase per wafer (based on high yield), if they're buying per die I assume yield is bad and will correlate with higher costs; I hope I'm wrong.
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post #15 of 21
Who knows, maybe they still are indeed taking bad chips, just not paying for them anymore
There will still be 6 core and 4 core BD with partially disabled core segments, I assume they will continue to use slightly defective core parts similar to Phenom II.
post #16 of 21
Quote:
Originally Posted by fools79 View Post
Well I really hope that the 28nm process is a really nice high quality performance wise, I remember hearing oh the 68xx's will be great and will be 28nm, then is was supposed to be the 69xx's. Now AMD is only willing to pay by the good chip? Oh yeah it's been an extra year and now their still not really all that confident with the production quality?

Amd please don't let your self get distracted, yes... yes... I know that bulldozer is running late, fine things happen. But if a chip fab can't live up to your requirements just move on, I don't want my upcoming 7xxx card to end up being your take on a 590.

amd has a signed agreement with glofo to use more of their fabs capacity in the future ... amd cant back up out of such contract easily ... and anyway glofo is amd's past foundry .. so they know alot about this business ...


paying for good chips instead of paying for a full wafer and end up paying for some duds that you cant sell is better.. its win/win for amd ...


so i wish them well with this new approach



Quote:
Originally Posted by rocketman331 View Post
If they're buying per die instead of wafer that's bad news.

Manufacturers purchase per wafer (based on high yield), if they're buying per die I assume yield is bad and will correlate with higher costs; I hope I'm wrong.

doesnt mean that at all ... it could mean that amd was losing valueable money and since they own 30% shares of glofo they negotiated a deal because they have a contract to use glofo more and more in the future .. so glofo said why not .. they are a customer we wont lose anyway ....


so glofo take the blow on the yield part .. not that it might be horrible .. and amd makes as much proffit as they can ... so more money for development .. and maybe more aggresive pricing .. wich would result in more dies request .. wich is more demand for glofo wich is win for them ....



or it could be something more simple along the line of OMG bulldozer is fail or something stupid like that
Edited by Fr0sty - 4/5/11 at 9:28pm
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post #17 of 21
Quote:
Originally Posted by Fr0sty View Post
amd has a signed agreement with glofo to use more of their fabs capacity in the future ... amd cant back up out of such contract easily ... and anyway glofo is amd's past foundry .. so they know alot about this business ...


paying for good chips instead of paying for a full wafer and end up paying for some duds that you cant sell is better.. its win/win for amd ...


so i wish them well with this new approach






doesnt mean that at all ... it could mean that amd was losing valueable money and since they own 30% shares of glofo they negotiated a deal because they have a contract to use glofo more and more in the future .. so glofo said why not .. they are a customer we wont lose anyway ....


so glofo take the blow on the yield part .. not that it might be horrible .. and amd makes as much proffit as they can ... so more money for development .. and maybe more aggresive pricing .. wich would result in more dies request .. wich is more demand for glofo wich is win for them ....



or it could be something more simple along the line of OMG bulldozer is fail or something stupid like that
Either this.. Or theyre just having a really hard time with initial 32nm production.. I thought i remember hearing intel had problems with their 32nm production process right off the bat too
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post #18 of 21
Quote:
Originally Posted by killeraxemannic View Post
Sweet this just means that AMD is finding a way to make the BD chips cheaper for consumers!
No. Charging per die means that GloFo's yields are very bad. It means that AMD are sucking tonnes of loss from bad wafers at the moment. This means that AMD will be paying quite a high price per die - purely because the other dies are of bad quality. They'll be saving some money in the short term, but if GloFo improves its 32nm process, it could tip the balance towards AMD losing lots of money.

This is a real indicator of GloFo performance - even nVidia pay by the wafer at TSMC, and they had torrid yields at one point.
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post #19 of 21
I would say this is a smart move. Now we'll have less complaining that products come DOA or need to be RMAed. Save some money. That doesn't mean you won't be able to get products that unclock. They just give you the good chips. Good chips work. Unclockable chips are unclockable.
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post #20 of 21
Quote:
Originally Posted by HybridCore View Post
I would say this is a smart move. Now we'll have less complaining that products come DOA or need to be RMAed. Save some money. That doesn't mean you won't be able to get products that unclock. They just give you the good chips. Good chips work. Unclockable chips are unclockable.
Not true. DOAs are caused by damage in transit - not at the fab - those ones are filtered out and never get that far. Of the chips made, between 10 and 50% could have an issue of some kind. This article goes into detail about the process of making a die and binning - quite interesting: http://www.bit-tech.net/hardware/cpu...and-to-shelf/1
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