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Proper way to apply AS5 thermal paste?

post #1 of 26
Thread Starter 
I read the instructions on their website but they are really confusing. They start going on about priming the heatsink, when it also clearly states to never spread the paste. I'm starting to get really confused.

Does anyone know the proper way to apply it for best results?

Also, I heard that I should use alcohol to remove the current paste from the CPU. Would 70% rubbing alcohol be okay?
post #2 of 26
I do a line down the middle of mine.
post #3 of 26
Thread Starter 
Quote:
Originally Posted by KBcobra View Post
I do a line down the middle of mine.
Does this method work the same for all CPU's? I have the CPU in my signature (I know it is the wrong forum, my mistake).
post #4 of 26
I do a "x" with a "+" through the middle then spread it with a piece of cut up credit card.
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post #5 of 26
I usually use the X application. Just make a small X with the TIM in the center of the CPU. Do not apply to much or use to little, because you will negatively affect temps as well. Do not spread the TIM before you put on the heatsink or you might create air pockets which hinders dissipation as well. Also do not pull the heatsink from the TIM once it has come in contact with it, because that too will create air pockets.

Alcohol is fine to clean the old TIM off with. %90 Isopropyl is better but not an absolute. I always use Artics TIM cleaner which eats right through old TIM, and makes cleaning CPU's or GPU's a lot easier.
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post #6 of 26
with anything viscous i use the line method or the x method.... it tends to spread better that way as opposed to using the pea method.

what i do for shin etsu... but i've never used as5... i've heard it is just as viscous
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post #7 of 26
A small, Pea Sized dot is the only and best way to do it.

A full line up the center, is way too much TIM, and doing a small "x"; has too much risk for the potential of creating air pockets.

Most all manufacturers of TIM, all recommend putting just a small pea sized dot, and then letting the HSF and CPU spread it on their own once pressed together.
     
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post #8 of 26
I also do not use AS5 anymore, as it requires (as per its own instructions) up to 200 hours running time for proper curing; based on that i would have to leave my computer on for a full week just for the AS5 to reach its full potential.

I have since switched instead to ICD7 as it has an Instant curing time and diamond is a better heat conductor then silver anyway; and going with the small pea dot, I've since seen a 2 - 3c drop over AS5.
     
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post #9 of 26
Small X, then clamp down the heatsink.
    
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post #10 of 26
Quote:
Originally Posted by cjc75 View Post
A small, Pea Sized dot is the only and best way to do it.

A full line up the center, is way too much TIM, and doing a small "x"; has too much risk for the potential of creating air pockets.

Most all manufacturers of TIM, all recommend putting just a small pea sized dot, and then letting the HSF and CPU spread it on their own once pressed together.
i disagree... i've used multiple tims and have tried various methods....

with viscous tims like the nt-h1 and shin etsu x23

the pea method always results in higher temps vs the line or x method.
ALWAYS

why is that then?

the pea method with viscous tims tends to coagulate in the center of the block and it creates a thick application while the line or x method evenly distributes the tim throughout the block with a overall thinner conclusion

EDIT: the pea method works best for more aqueous tims or tims that aren't as viscous
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Galbus
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