post #21 of 21
Maybe you should reapply TIM.
A decrease of only 10c in load temps over the stock HSF assembly, with the Hyper 212+ on that chip, isn't that impressive.

Try using the 3 line + pack into the grooves method. Thats what I did and it worked perfectly the first try. I used the edge of a cleaned credit card to pack into the grooves, before applying the 3 lines. I made sure there was only TIM in the grooves and did my best to scrape it off the base & heatpipes before applying the 3 lines. I used MX-3.
Edited by Dirtyworks - 4/7/11 at 5:24pm
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My Scarlet Sin
(16 items)
 
  
CPUMotherboardGraphicsRAM
Core i7-3770k @ 5GHz HT ASRock Z77 Extreme6 eVGA GTX 1070 4x4GB Vengeance @ 1600 CAS7 
Hard DriveCoolingOSMonitor
120GB Plextor M3 SSD | 2x1TB RE4 RAID 1 XSPC Rasa | RX120/240 Windows 7 x64 27" Overlord | 22" U2211H | 32" CCFL Sony 
KeyboardPowerCaseMouse
Cooler Master QuickFire Rapid-i Seasonic X-760 Lian-Li PC-8FIR Logitech G502  
AudioOther
ODAC | Tascam US-366 | Adam A7X Monitors Adam A7X Studio Monitors 
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