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Is there a "correct" way to apply thermal paste to my cpu and heatsink - Page 2

post #11 of 19
Quote:
Originally Posted by mdatmo View Post
Best way is to apply it and then lift up the heatsink to check how the TIM spread. Then adjust the amount of TIM you used so that the CPU is covered in a thin layer. With your CPU I would go with the X method.
I wouldn't recommend this. Lifting up the heatsink after applying the paste is a good way to get air trapped, and air doesn't conduct heat as well as paste does.

It's very easy, just put a blob of paste down in the center of the CPU (about the size of a BB, smaller than a pea) then slowly and evenly press the heatsink/block down. You can give it a few degree twist in either direction if you like before aligning the mounting holes. That's it. Simple and effective.

Depending on what kind of paste you are using, the mfg. may recommend heating it a bit before application to make it spread better. They also may recommend stressing the CPU to heat it up and help the paste set. Read the directions for your specific TIM.
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post #12 of 19
Quote:
Originally Posted by JasonCz View Post
I wouldn't recommend this. Lifting up the heatsink after applying the paste is a good way to get air trapped, and air doesn't conduct heat as well as paste does.
I think he meant to remove the heatsink to see how it spreads the first time, then remove/clean the TIM and adjust the amount needed.

I've always used the Dot method. Took me a few tries to get it the right size, but now it's no problem.
Edited by huhh - 4/8/11 at 6:16am
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post #13 of 19
Quote:
Originally Posted by huhh View Post
I think he meant to remove the heatsink to see how it spreads the first time, then remove/clean the TIM and adjust the amount needed.
Of course this.
 
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post #14 of 19
For the 212+ you want to apply a small amount onto the heatsink itself first and cram some TIM into into the creases between the heat pipes, then use the X-method on the cpu itself...i tried various ways with the 212+ and that is the best so far, gives a good 2c lower than the regular blob or pea size method.
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post #15 of 19
On my 212, I filled in all the gaps around the heatpipes, then i put 2 lines of paste about half an inch long on the two middle pipes.
    
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post #16 of 19
use the DOT method. Put like literally a bb-gun pellet sized drop smack dab in the center. mount your cooler and let gravity do the rest. On a 212+, fill in the gaps like others have suggested. Personally, I go with an X in the center of the cpu
post #17 of 19
Quote:
Originally Posted by Capwn View Post
What kind of heatsink is it?
Diff styles use different application methods on occasion.
HDT coolers for example, Ive found the Xmethod to be the best.
I personally prefer the X method as well. I've heard it tends to work better with multicore processors than the dot method; but I doubt the difference is all that significant.
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post #18 of 19
Quote:
Originally Posted by mdatmo View Post
Best way is to apply it and then lift up the heatsink to check how the TIM spread. Then adjust the amount of TIM you use so that the CPU is covered in a thin layer. With your CPU I would go with the X method.
I put very thin lines on the copper pipes on my 212+,should this be ok?
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post #19 of 19
Quote:
Originally Posted by amd-dude View Post
For the 212+ you want to apply a small amount onto the heatsink itself first and cram some TIM into into the creases between the heat pipes, then use the X-method on the cpu itself...i tried various ways with the 212+ and that is the best so far, gives a good 2c lower than the regular blob or pea size method.
this is what i did for mine as well, works great, on stock i idle at 25c
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