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how to choose finger cots to spread thermal grease out?

post #1 of 26
Thread Starter 
hi dear all

anyone knows how to choose the finger cots/gloves to spread Thermal Compound / Grease out?

there are 6 kinds of finger cots/gloves, I'd like to know which one is right.
Note: Using this thing to replace business card is really a good idea!

LATEX FINGER COTS
S-11468 Powdered
S-11469 Powder-Free

NITRILE FINGER COTS
S-15364 Powdered
S-15365 Powder-Free

ESD FINGER COTS
S-14146Pink Anti-Static
S-14147Black Conductive
post #2 of 26
It is actually better to not spread the paste first and instead just apply a blob on the center in the size of a healthy pea and let the heatsink spread the paste.

That way, air bubbles/pockets are avoided. Or really, the chances of getting air pockets are greatly reduced.
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post #3 of 26
Quote:
Originally Posted by TwoCables View Post
It is actually better to not spread the paste first and instead just apply a blob on the center in the size of a healthy pea and let the heatsink spread the paste.

That way, air bubbles/pockets are avoided. Or really, the chances of getting air pockets are greatly reduced.
cant agree more. All this spreading nonsence is just plain weird! use a pea sized/rice sized dab in the middle and your ready to rock and roll!
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post #4 of 26
i use to spread it around, but realized that was just a waste of time. just throw a blob on and put the cooler on.
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post #5 of 26
I think pea sized is a bit too much, try BB size
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post #6 of 26
Quote:
Originally Posted by Rogy56 View Post
I think pea sized is a bit too much, try BB size
I tried BB size once, but it wasn't enough. Here's what I do:
  1. I apply paste
  2. I install the heatsink on all the way
  3. I remove the heatsink to check the paste application
  4. I fix the paste application as needed
  5. I install the heatsink on all the way again
  6. I remove the heatsink to check the paste application again
  7. I fix the paste application as needed
  8. I install the heatsink on all the way again

So, I literally prefer to check the paste application twice. Usually it's fine the 2nd time I check it. However, the first time I ever did this, I used the BB size and I had to check the paste three times instead of two times. This is because I had to keep adding paste each time in order to get it to cover enough of the CPU so that it looked like it's supposed (based on pictures we've all seen).

So, now I just use a blob about the size of a healthy pea, and it's usually fine the first or second time I check the paste application.
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post #7 of 26
I know everyone has different opinions on this but for me I currently use a vertical line on my i7 and let the HSF spread it out. On my core 2 Quad I used a horizontal line. To me it makes sense to apply thermal compound over the top of where the die is. As the i7 is a rectangle and most intel dual and quad cores are too the orientation of the die under the heat spreader can be different. I like to make sure the compound covers the surface of heat spreader above the die. A single dot in the middle was fine for single cores but a rectangular die might not be covered completely by this.

I also don't like to remove the HSF and reapply it with first cleaning the CPU and HSF I will clean them and reapply compound every time I remove the HSF. I spend several times doing this to find the right amount required for a new CPU socket (usually 2 looks and the 3rd time I felt I had it right) now I just remember what seems to be enough. For modern chips I think the old BB size dot is way too small, as the CPU die has gotten a lot bigger in the recent years (I was surprised at the size difference of my i7 to my C2Q) a volume equivalent to a small pea I find more suitable. I think by removing the HSF and reseating without cleaning it risks the introduction of more air bubbles than spreading out the compound with a gloved finger ever could.

My method may waste a bit of thermal compound to begin with but these are my thoughts and to me seem logical.

The arctic silver website has a guide which recommends different methods depending on CPU manufacture and model. To me they seem to make sense and ensure the whole of the die is covered. Just choose your manufacture and model.

http://www.arcticsilver.com/methods.html
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post #8 of 26
Yeah, I use teh pea/grain of rice method. Seems to work best for me. You should try it out. I just plop some down and then put teh Noctua over it. I dont like to remove it afterwards as it might introduce air bubbles.
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post #9 of 26
Thread Starter 
Quote:
Originally Posted by firebirdjimbo View Post
i use to spread it around, but realized that was just a waste of time. just throw a blob on and put the cooler on.
Quote:
Originally Posted by firebirdjimbo View Post
i use to spread it around, but realized that was just a waste of time. just throw a blob on and put the cooler on.

ok guys, if “just throwing a blob in the middle and putting the cooler on†is correct, why some of the thermal paste packages have an "apply tool" included??

I'm sorry but I really cannot agree the "in the middle" method!

see pics:


post #10 of 26
I really don't know, but I think those tools are a waste of plastic (they're a gimmick in order to hopefully increase sales). I have never put much effort into applying thermal compound a certain way, and I've always had great results. My temps are just fine.
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It's a computer!
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Hard DriveHard DriveHard DriveOptical Drive
250 GB Samsung 840 EVO (C:\) 250 GB Samsung 840 EVO (D:\) 150 GB WD VelociRaptor Samsung SH-S243N 24x DVD Burner 
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Samsung SH-S203N 20X DVD Burner Thermaltake Frio Win 7 Home Premium x64 SP1 Retail AOC G2460PG (24" 1920 x 1080 144Hz G-SYNC) 
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Filco Majestouch 104-key Cherry MX Blues w/NKRO Corsair HX650 (Bronze, ordered on 12-12-2009) CM 690 Intellimouse Optical (1.1A) 1000Hz polling rate 
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Basic, but premium round X-Fi Titanium HD Klipsch ProMedia 2.1 (with 16 AWG Monster Cable... 
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