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Will Thermal PAD replace Thermal Compound?

post #1 of 7
Thread Starter 
Can someone tell me why thermal pads don't replace thermal compound?

Thermal compound is not as convenient as thermal pads, in my opinion.
And it cannot be reused while thermal pads can.

As a typical thermal pad, the thermal conductivity is 3.0-5.0 W/mK.
For example, EK Thermal Pad is 5 W/mK.

As typical thermal compound, the thermal conductivity is 2.0-6.0 W/m.k
For instance,
Xigmatek PTI-G4512 Thermal Interface Conductive Compound is 2.5 W/m.k,
Antec Formula 6 Nano Diamond Thermal Compound is 5.3 w/mK,
Deep Cool Z3 (Silver TIM) Thermal Paste only has 1.134 W/m-K,
Cooler Master ThermalFusion 400 Ultimate Thermal Compound is 2.89 (W/m-K),
octua NT-H1 Thermal Compound is 2,49 w/mK.


Well, usually a thermal pad is a little bit better than thermal compound.
Why don't most people use thermal pads to cover CPU/GPU/NB/SB?

I'm really confused.

post #2 of 7
Im guessing you have stock in thermal pads? Or is this a legit question. I only ask because its your first post and it seems like you are trying to push a product. If not, then welcome to the site.
post #3 of 7
Never used thermal pads personally, but from the looks of them (thick), thermal pads provide the entire path for heat to escape a chip, which is vastly less efficient than a CPU configuration, where most of the heat transfer is from the CPU directly to the heatsink. Any auxiliary crevices in either surface are filled with thermal compound, which provides a better than air (but not better than metal on metal) heat transfer medium.
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post #4 of 7
Quote:
Originally Posted by Xyxyll View Post
Never used thermal pads personally, but from the looks of them (thick), thermal pads provide the entire path for heat to escape a chip, which is vastly less efficient than a CPU configuration, where most of the heat transfer is from the CPU directly to the heatsink. Any auxiliary crevices in either surface are filled with thermal compound, which provides a better than air (but not better than metal on metal) heat transfer medium.
This.


This is why lapping can help so much, because you almost need no thermal compound.
post #5 of 7
My personal experiance with "Thermal Pads" hasnt been a good one. Stick the the past. not as easy to apply, but results are more consistant, and from every review I have ever seen Pads can't keep up with Past like TIM's. I'm sure some one will correct me if im wrong.
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post #6 of 7
That's easy. A "pad" is a flexible (compared to solid metal, tmk are paraffin-based) non-continuous solid, which means you aren't actually "conducting" heat. It becomes a mixture of conduction and convection, in addition to the aforementioned problem of plane variances (heat not going 'up').
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post #7 of 7
Thread Starter 
Quote:
Originally Posted by Aeschylus View Post
That's easy. A "pad" is a flexible (compared to solid metal, tmk are paraffin-based) non-continuous solid, which means you aren't actually "conducting" heat. It becomes a mixture of conduction and convection, in addition to the aforementioned problem of plane variances (heat not going 'up').
excellent explanation!thanks but i did not really get this sentence "which means you aren't actually "conducting" heat. It becomes a mixture of conduction and convection"
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