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Can I remove the cover off my MSI 6970 w/o damaging the thermals?

post #1 of 8
Thread Starter 
I just got this card and in order for me to be sure what water block to get I need to take a photo of the PCB and send it to Frozencpu, even though MSI confirmed my cards s/n is a ref PCB but they could not tell me if it the new revised one or not. It is a little frustrating. here is a picture of the exact one I got from Frys but on neweggs site. Will I damage the thermal contacts or whatever they use for the heatsinks? I dont have any extra of that stuff to re-apply it so I want to be sure before I do it. I wanted to get teh EK V1 block. Basically can I just remove the cover and replace it with no issues?

This what my card and back plate looks like exactly.
http://www.newegg.com/Product/ImageG...th%20Eyefinity
post #2 of 8
While it might not be the best idea, you could most likely reuse the thermal pads attached to the stock cooler. You would definitely need to clean off/re-apply thermal compound though. If you don't have extra compound, I would say hold off. You would need some for a new block anyway, so it's never bad to have some around. I recommend mx-3.

Also, since that card uses a reference cooler it SHOULD be compatible with EK reference block. Guess it's always better to be sure on something like that though.
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post #3 of 8
Thread Starter 
Ya I figured as much. I will leave it alone until I get some compound. IS there a right and wrong way to apply compound? I have never done it before. I think you are right that it is a going to take a ref V1 EK block

Quote:
Originally Posted by champyg View Post
While it might not be the best idea, you could most likely reuse the thermal pads attached to the stock cooler. You would definitely need to clean off/re-apply thermal compound though. If you don't have extra compound, I would say hold off. You would need some for a new block anyway, so it's never bad to have some around. I recommend mx-3.

Also, since that card uses a reference cooler it SHOULD be compatible with EK reference block. Guess it's always better to be sure on something like that though.
post #4 of 8
Small dot in the middle of the chip's heatspreader. NOT PEA SIZE for the love of God... I know somebody is going to say that. A pea is 10X too much...

I know this is a picture of a CPU heat spreader but the concept is the same.


See how absolutely ginormous the pea is compared to what they use?
    
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post #5 of 8
Thread Starter 
That is a good refeence for me. thanks a bunch

Quote:
Originally Posted by Epitope View Post
Small dot in the middle of the chip's heatspreader. NOT PEA SIZE for the love of God... I know somebody is going to say that. A pea is 10X too much...

I know this is a picture of a CPU heat spreader but the concept is the same.


See how absolutely ginormous the pea is compared to what they use?
post #6 of 8

The right way to apply compound is to use as little as possible. The generally accepted method is to squeeze out a small dot in the center of the die and let the pressure of the heatsink spread it out evenly. Here is a short video (there used to be a better one somewhere, but can't find it now) showing a few different methods, but the dot method at the beginning is the one I would recommend.

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post #7 of 8
Quote:
Originally Posted by Epitope View Post
Small dot in the middle of the chip's heatspreader. NOT PEA SIZE for the love of God... I know somebody is going to say that. A pea is 10X too much...

I know this is a picture of a CPU heat spreader but the concept is the same.


See how absolutely ginormous the pea is compared to what they use?
depends on the goo you use. for as5 or another thin liquid type paste you'd want to double what's pictured. for thicker stuff like icd7, you want probably 3/4 of the pea that's pictured because those are some giant peas.

the die is fairly large and with an exposed die you want to make sure it's covered fully. this is 1 area where you want to overdo it if you're not sure.

also the 6970 block is terrible. not smooth at all.
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post #8 of 8
Could i just 'cut off' the front side of the stock cover? it is so hot in sandwich crossfire and i was thinking to make it replaceable like a protector and remove it when in use so that the fan can suck in all the air coming from the fan. the topside hole is not an option as the cards almost touch even with wedges. right now i am directing the air to the narrow opening at 6and8pin connectors and it is already makes a difference.it has to be possible to make the front side removable it would make a very effective cooling.

any ideas? thanks
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