DavidNJ

That is, why not just have the thinnest possible copper plate, and jet high speed water against it?

Or better yet, why not have no bottom at all, just seal around the perimeter of the IHS, and jet the water directly against the IHS. That would eliminate the role of thermal grease and any value from lapping the IHS or bowing the water block. With 70# of clamping pressure, it should be easily possible to seal a 2" perimeter with at most 10psi pressures.

Xx573v3xX_Z28

i believe someone has tried this once before and we never heard back from him after he tried it.

__________________
Back in the Day Our fathers Street raced, well its still going on but way Stronger. UNDERGROUND STREET DETROIT

Tuniq tower 6 step mod
MICHIGAN OVERCLOCKERS
THE CHEVY Owners CLUB!!!

Soon Upgrade COOLERMASTER V8 cpu heatsink
Cpu-z Verified 3.80Ghz
13K 3dmark06 Verified

thenailedone

Because fins increase the actual surface area in which heat transfer can take place...

__________________

He who wishes for roses without thorns, should steer clear of gardens and woman...
- Eritza Naudè

thealmightyone

You need fins, plain and simple. Unless you use liquid nitrogen or phase change, you cannot remove heat quick enough from the die to keep it cool.

nategr8ns

^ perfect answer right there.

The fins, even though they require thermal paste and lapping/bowing, can let off more heat than just a bare processor.

__________________

mz-n10

isnt the stingers built with a super thin base plate?

DavidNJ

Well, if that were true the tallest fins would be on the hottest area. However, the shortest fins are on the hottest areas.

Second, at least in Martin's calculations, over half the heat differential to air is lost in the thermal grease.

And for that matter, TEC's are right against the IHS...no fins.

thealmightyone

Water is not this super holy absorber of heat you think it is; it still needs surface area to conduct heat. TEC's don't need fins as they are very very good at conducting heat, due to being so cold.

thenailedone

...basics of thermal dynamics...

__________________

He who wishes for roses without thorns, should steer clear of gardens and woman...
- Eritza Naudè

DuckieHo

Waterflow has to be balanced with heat disbursement. While taller fins in the middle would increase heat absorption to the water, you need to look at the whole picture.

Thermal grease has always been known to be a massive thermal barrier.

TECs need cold plates. The IHS isn't thick enough to spread the heat over the entire TEC's area.

__________________
WANTED: Socket M Core/Core 2 CPU, SUGO-02 Black, quality 802.11b/g PCI Card
To answer most of your questions: (1) a fridge cannot cool a PC (2) 64-bit OS for over 3.4GB (3) If a PCIe card fits, it will work (4) Resolution, not screen size (5) If you have a question, it is not news (6) Report, not respond to Spam (7) Single/Non-Modular Rail PSUs are NOT better than Multi-Rail/Modular