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And... I delidded my A10-5700!

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post #31 of 37 (permalink) Old 01-23-2016, 01:18 PM
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Nice delid. Good to see someone else joined the delidded APU club. Beware of pump-out with MX-4, though NH-T1 is worse for that. CLU or that new Grizzly metal paste should be your next step, if you plan on going that far. The Grizzly stuff may be better.

Also, I have not experienced problems with mount pressure using my Noctua NH-d14. Might be a different mounting mechanism than for your HSF? And yeah totally lap that IHS now that it's loose. Take it to 400 grit, no sense in going any further.

Watch this space for future . . . uh . . . stuff! Yeah. That.
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post #32 of 37 (permalink) Old 01-23-2016, 03:51 PM
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Originally Posted by drmrlordx View Post

Nice delid. Good to see someone else joined the delidded APU club. Beware of pump-out with MX-4, though NH-T1 is worse for that. CLU or that new Grizzly metal paste should be your next step, if you plan on going that far. The Grizzly stuff may be better.

Also, I have not experienced problems with mount pressure using my Noctua NH-d14. Might be a different mounting mechanism than for your HSF? And yeah totally lap that IHS now that it's loose. Take it to 400 grit, no sense in going any further.


400 grit is really, really coarse sandpaper. All it is good for is scratching. I probably would start with 400 grit and work my way up to 2500 grit.

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post #33 of 37 (permalink) Old 01-24-2016, 05:59 PM
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It may be coarse, but you want some surface texture to increase contact surface area. I read an article some time ago from a guy that was mating quartz surfaces to metal heat sinks that said that his lab tested different grits of sandpaper for preparing mating surfaces, and 800 grit was optimal for the silica-based TIM that they were using. Lapping to higher grits flattened out the surfaces so much that contact area was reduced more than was mean bondline thickness, reducing thermal transfer.

Of course, when dealing with one of the metal pastes, surface coarseness may cease to be of issue due to the way it behaves (or the way I think it behaves), and lapping may be of no real value. But going from the nickel surface to a 400-grit lapped copper surface will improve things. 800 grit might be better, if you're using a conventional paste. Mirror finishes are basically pointless from a heat transfer PoV.

Watch this space for future . . . uh . . . stuff! Yeah. That.
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post #34 of 37 (permalink) Old 01-25-2016, 04:54 PM
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Originally Posted by drmrlordx View Post

It may be coarse, but you want some surface texture to increase contact surface area. I read an article some time ago from a guy that was mating quartz surfaces to metal heat sinks that said that his lab tested different grits of sandpaper for preparing mating surfaces, and 800 grit was optimal for the silica-based TIM that they were using. Lapping to higher grits flattened out the surfaces so much that contact area was reduced more than was mean bondline thickness, reducing thermal transfer.

Of course, when dealing with one of the metal pastes, surface coarseness may cease to be of issue due to the way it behaves (or the way I think it behaves), and lapping may be of no real value. But going from the nickel surface to a 400-grit lapped copper surface will improve things. 800 grit might be better, if you're using a conventional paste. Mirror finishes are basically pointless from a heat transfer PoV.


Well that goes against what most people think about lapping but it may be true. Most people lap to a mirror finish. I stopped lapping cpu's because I lost track of what they were after I put them away. I used to lap heatsinks also. It is a real lot of work to get that mirror surface. Not worth it imho.

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post #35 of 37 (permalink) Old 02-06-2016, 01:39 PM
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Why delid? AMD is renowned for their heatspreadding capabilities! That is just dumb! Unless you got it running at least 4.6 GHz! Did you think of oc beyond the 4.4 GHz border? OR did you just do that to try it out? By trying other thermalpastes you could have gotten a drop of 10-20 C on the same CPU without delidding! Referring to my own 4350 Vishera, I´m pretty sure of running it up to 5.4 GHz without ever reaching the border of >60 C. AND I would never delid any AMD-CPU, due to the exceptional heat-dissipation of any AMD-CPU!
If you want to be part of the delidding community: Get any INTEL (Haswell, Haswell-E, Sandy-bridge or Skylake) and I´m sure you could boost those temps! FP
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post #36 of 37 (permalink) Old 02-06-2016, 02:29 PM
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Why delid? AMD is renowned for their heatspreadding capabilities! That is just dumb! Unless you got it running at least 4.6 GHz! Did you think of oc beyond the 4.4 GHz border? OR did you just do that to try it out? By trying other thermalpastes you could have gotten a drop of 10-20 C on the same CPU without delidding! Referring to my own 4350 Vishera, I´m pretty sure of running it up to 5.4 GHz without ever reaching the border of >60 C. AND I would never delid any AMD-CPU, due to the exceptional heat-dissipation of any AMD-CPU!
If you want to be part of the delidding community: Get any INTEL (Haswell, Haswell-E, Sandy-bridge or Skylake) and I´m sure you could boost those temps! FP

Dude, you obviously don't have a clue of what you are talking about. You don't even know how to uh, tell falsehoods well.


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post #37 of 37 (permalink) Old 02-07-2016, 12:12 PM
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Originally Posted by fphyatt View Post

Why delid? AMD is renowned for their heatspreadding capabilities! That is just dumb! Unless you got it running at least 4.6 GHz! Did you think of oc beyond the 4.4 GHz border? OR did you just do that to try it out? By trying other thermalpastes you could have gotten a drop of 10-20 C on the same CPU without delidding! Referring to my own 4350 Vishera, I´m pretty sure of running it up to 5.4 GHz without ever reaching the border of >60 C. AND I would never delid any AMD-CPU, due to the exceptional heat-dissipation of any AMD-CPU!
If you want to be part of the delidding community: Get any INTEL (Haswell, Haswell-E, Sandy-bridge or Skylake) and I´m sure you could boost those temps! FP
That was a Trinity APU that the OP delidded. It uses ordinary TIM underneath the heatspreader, just like an ordinary Intel chip does. The FX line has excellent heatspreading capabilities because those are soldered underneath. But AMD went to TIM on their APU lines until Godavari.

Also, all Intel "E" processors and all Sandy Bridge and earlier are soldered. One reason a lot of people here still swear by their 2x00K Sandy chips is because they overclock so well thanks to being soldered, and because of that, they are still very competitive even after nearly five years.

And if you want to hit 5.4 GHz on a 4350 with temps under 60, you're going to need some LN2.
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