Originally Posted by ItsMB
At the moment, which is the best RAM kit for ryzen, i mean the best not on speed/latency benchs, the best on stability/flexibility/perfomance.
Did you make internal latency tests to al cores with diferent RAM speeds? Which is the best sweet point for the fabric? Did you find limits on it?
Im not that interested on having best perfomance on RAM, im more interested on fabric and make multithreading work properly with a decent RAM.
When i made some test on SMT on and OFF, on gaming and measuring latencys is more or less the half (edit no double) with SMT OFF the smoothness is real. Just want my CPU as smooth as posible.
Which parameters can help on it. When i made on 1403 the ryzen OC in same score than 6950x i asked myself how good can be ryzen with the sweetest fabric OC.
Maybe im just wrong, have bad concepts or is just not posible with these drivers or windows management.
A high quality (3200MHz CL14 rated, or better) B-die based single rank kit is by far the best way (in terms of the performance and the ease of use) to go with Ryzen. B-die is the only IC currently available, which can simultaneously reach sufficiently high MEMCLKs and tight timings. In cases where 16GB RAM is simply not sufficient, I would recommend purchasing four single rank modules rather than two dual rank (16GB) modules. Due to the differences how the memory controller handles single and dual rank modules and the signaling differences between the two types of modules themselves, it is easier to get four single rank modules to work at high MEMCLKs and with tight timings. Compared to two single rank modules the performance on dual rank modules is somewhat better at the same MEMCLK, the performance advantage being roughly equal to increasing the MEMCLK ratio by one (133MHz). The same performance benefit can be acquired by using four single rank modules as well.
Between 1066 - 1333MHz (2133-2666MHz MEMCLK) the performance improvements from the increased data fabric speed are vast and totally unquestionable. At 1466MHz (2933MHz MEMCLK) the performance improvements are still there, but they are already starting to tail off. At 1600MHz (3200MHz MEMCLK) and above there are literally no data fabric related gains anymore and the only performance improvements come from the higher memory bandwidth and lower memory latency. If the CPU could hit significantly higher speeds than they currently can (> 4.5GHz), the scaling from the higher fabric speed alone might or might not continue further. At >= 3066MHz MEMCLK the fabric speed itself is not the bottle neck. Personally I would trade 3733MHz with CL16 timings to 3066MHz CL10 any day.
Samsung B-die > Hynix AFR > Hynix MFR / Micron
Of the most common DDR4 ICs Hynix MFR is the worst for Ryzen.
It can achieve lower tRCDR/W and tRP than Hynix AFR, however it cannot handle the extremely performance critical tRDRDSCL or tWRWRSCL timings < 4 CLK at 3200MHz. Both Samsung B-die and Hynix AFR can handle tRDRDSCL and tWRWRSCL 2 CLK at 3200MHz.
Also unlike Samsung B-die, neither of the Hynix ICs can handle GearDownMode = Disabled with 1T CR either.
All dual rank modules, regardless of the ICs are a major PITA to get working at high speeds. There are many reasons for that, one of them being the MEMCLK holes which occur much more often than on single rank modules.