So seems the weaker 8-10 phase design with individual high/low-side mosfets like the Onsemi VRM from MSI/Gigabyte designs is bare minimum for the 12-core and that is counting on active cooling for the VRM to keep them from hitting max temperatures to throttle and such?
Passive they overheat it seems from what we can gather.
Sure in the older boards they were meant tops for 8-core and manage but the new 12 & 16-core chips will draw more power even if TDP is 105W for these parts? PBO-settings <-- I reckon.
It's interesting the stock 3900X power draw topped out at 144W on the Gigabyte AORUS X570 Extreme temperate test of passive PCH. But then they drew more power on the cheaper boards?
Maybe they ran them un-gimped to get them to overheat but should be ok stock without PBO cranked up?
Seems techspot tested them all 144W stock all the way to max 195W with stock cooler and no other cooling(ok temps?). Not the same scenario as CLC or a tower cooler that I had seen above or otherwise when they overheat.
Gigabyte X570 AORUS XTREME, Ryzen 7 3800X PBO boost, 2x8GB 4866/1900 220.127.116.11.90.tRFC 680 1T 1.650V [Micron Rev.J]
4x8GB 3800/1900 18.104.22.168.66.tRFC 600 1T 1.700V Kingston HX434C19FB2K2/16 3466C19 1.2V (Micron Rev.E 19nm [D9VPP]),
2x8GB Kingston HX436C17FB3K2/16 3600C17 1.35V (Micron Rev.J 17nm),
2x8GB 3866/1933 22.214.171.124.60.tRFC 448 1T 1.590V Kingston HX436C17FB3K2/16 3600C17 1.35V (Hynix DJR 17nm)
Last edited by Nighthog; 07-12-2019 at 03:04 AM.