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Join Date: Sep 2012
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Originally Posted by AlphaC
hardware info NL as well as hardwareunboxed used a fixed voltage OC. I was just putting up the PBO numbers because ASUS slides had the PBO claim that they had better PBO performance.
Hardware info NL result ; R9 3900X @ 4.1 all core:
X570 Taichi $300 board = 61.4°C rear PCB , 62°C front of PCB
X570 Aorus Elite $200 board with zero heatpipes
= 64°C rear PCB while front is 66°C
MSI Ace rear PCB = 63.5°C while front is 66.1°C
Also it doesn't take a genius to figure out that having less fin area means higher thermals. It is also reflected in the Japanese review:
R9 3900X @ 40.5 multiplier in AVIUTL AVX load without airflow = 74.8°C
And this greek review (65°C with R9 3900X):
I would say 3 separate datapoints is a trend.
So the analysis is that the heat sink on the vrm is not substantial enough?
Technology is NOT a liberator . Whom technology serves is a class question.
Technology wielded by the capitalist class benefits only the exploiters.
Technology wielded by the working class will serve ALL Humanity.
Ryzen 9 3900X at 4.2 GHZ, MSI X570 MEG ACE motherboard, AlphaCool Eisbaer 360 cpu AIO cooler
32GB G.Skill TridentZ DDR4 4000mhz CL-19-19-19-39 1.35v Samsung 970 EVO m.2 NVMe 1TB
AMD Radeon VII gpu