Originally Posted by eBombzor
Wow you really won the lottery there. That OC at those voltages. Pretty insane. Did you offset the SoC voltage or did you manually set it to 1.05?
I am able to run these timings on my 3900x- I used 1.45v though
Here are the results:
Pretty awful and the latency is much higher, bandwidth is the same, I don't know if it's an MSI vs ASUS thing, different Windows configuration, the 3900x design or what. The settings from DRAM Calc produce this (Runs at 1T too- no GearDown):
Also, my L3 cache latency is 0.4ns slower.
Just thought you both would be interested.
Originally Posted by Cidious
So I know this is to talk about timings and the DRAM calculator but I'll share my experience with some custom cooling anyway
Since I own a kit of 2x8gb G.skill Bdie and a kit of Ballistix Sport 2x16gb Edie and the difference between the heavy solid heatsinks on the G.Skill and the flimsy ones on the Ballistix is enormous. So I thought I might be able to improve performance of my Edie kit a little more by putting some better heatsinks on it.
It came these black aluminium ones from Taobao. They cost just a few dollars and I ordered some 12 wmk thermal pads (1mm) with them but when trying to mount them I found that they are not well suited for use with dual rank modules as the next photo shows you. I tried thinning the thermal pads by rolling them but it would just not fit well. The only option would be shaving a bit of aluminium of the edge so they would be a bit thinner and use a thermal paste instead. Sadly I ran out of Kryonaut (only have conductonaut here atm) so I had to use some generic Chinese 2 wmk thermal paste which didn't work out so well.
After mounting the full kit with paste and booting up and running memtest I got errors after a while once they warmed up. I figured the thermal paste might be good enough but the biggest issue is that I found that the heatsinks are not anodized but painted in a thick layer of thermally isolating paint. When I pulled the sticks out straight after the memtest they were hot. Much more hot than with the standard heatsinks which tells me the heat gets trapped inside the paint. They are garbage. I tried to get the paint off but it's really tough. I used chemicals and sanding paper but the result is not very pretty.
I could sand both of them and zinc spray them instead of paint to get a cool look and still decent thermal radiation. But I decided not to go that way and get myself a kit of copper ones. Pretty much overkill but it will give me the option to test how much I can push them when heat is a non issue.
In the mean time I used the 12 wmk pads to stick the original strips of aluminum to and put them back in to the system and 0 errors.
What did I learn. Edie is very sensitive to heat. Maybe by cooling them better I can squeeze a bit more out of them. Who knows.
Be very careful doing this, and I would not advise any other members to attempt to remove the heatspreaders from their memory.
I ruined a very good G.skill DDR3-2400 cas10 kit by doing this, they use thermal glue to keep them on sometimes, and it literally pulled one of the ICs on the board off, which was stuck to the heatspreader, ruining the kit.
Originally Posted by bluechris
Yes, i managed to run my 3200 cl14 at 3800 by putting everything calculator told me but i like lower latency than bandwidth so i am in 3600cl14 atm.