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post #1 of 24 (permalink) Old 05-05-2016, 12:44 AM - Thread Starter
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I was wondering one day what would happen if you tried cooling a CPU with directly with water.
By completely removing the IHS cutting a hole in the bottom of a water block then gluing onto the PCB, allowing water to come in direct contact with the die.
Easier to explain with pictures.






Well the first things first the CPU survived the modifications which was my biggest fear after such butchery.

As for results I wont lie they were dreadful even with extreme pumping power with the water flowing over the die at an estimated 8m/s and modifying the water thermal conductivity with graphite Nano particles.

at best the coolest core was 65°C-85°C-95°C-105°C to the hottest.

My conclusion is the laminar flow of the water is why the last core topped out at 105°C
while the poor thermal conductivity of water is why even the first core was rather warm as I was working in 12°C ambient garage temperature.

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post #2 of 24 (permalink) Old 05-05-2016, 12:49 AM
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##Doing this will probably ruin this CPU, but what a cool experiment!##
Warning: Spoiler! (Click to show)
How thick is the outside of the die? Totally score it with an x-acto knife to make microchannels in the chip itself.


Also, mad brave trying this!
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post #3 of 24 (permalink) Old 05-05-2016, 02:51 AM - Thread Starter
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Quote:
Originally Posted by McMogg View Post

##Doing this will probably ruin this CPU, but what a cool experiment!##
Warning: Spoiler! (Click to show)
How thick is the outside of the die? Totally score it with an x-acto knife to make microchannels in the chip itself.


Also, mad brave trying this!

I thought about sand blasting the die to create turbulence but still even if I managed that... I still need to over come the poor thermal conductivity of water 0.58W(m.K) compared to copper 401W(m.K)
Now I know why there is a IHS
to be honest with pure water and a D5 pump the temps were 95°C- 105°C-105°C-105°C

I am wondering how to remove the copper base plate from a perfectly good 3770k, I used a used a NASA approved epoxy glue for its outstanding characteristics, I.e. resistance to de-laminating when submerged in solvents.
it is good for 4.8Ghx @ 1.35v

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post #4 of 24 (permalink) Old 05-05-2016, 03:09 AM
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I think the best option for this sorta stuff is to solder copper fins onto the die, almost like taking a soldered CPU and CNC milling fins onto the IHS.
Direct die cooling isn't a great idea unless you pump water through the die itself, but then you're going to struggle with flowrates and whatnot.
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post #5 of 24 (permalink) Old 05-13-2016, 12:15 PM
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Hi,

From what I see the water is just passing over the die : that's really not gold for the thermal transfert.
That's why your cores are overheating and reaching 105 degrees at which point they throtte to avoid heating even more.

What you need to do is to force the water to impact the die, this method is called jet impingment cooling.
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post #6 of 24 (permalink) Old 05-14-2016, 09:22 PM
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Quote:
Originally Posted by Bap2703 View Post

Hi,

From what I see the water is just passing over the die : that's really not gold for the thermal transfert.
That's why your cores are overheating and reaching 105 degrees at which point they throtte to avoid heating even more.

What you need to do is to force the water to impact the die, this method is called jet impingment cooling.

+1
Several years ago Ive seen a thread where someone delidded a 920 and made a custom waterblock where the incoming water would directly impact the die. Needles to say I dont remember the specifics but the temp drops were not substantial over a lapped IHS setup.

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post #7 of 24 (permalink) Old 05-15-2016, 12:40 AM
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Interesting, I've never see that one, I'll go search for it.
I am maintaining a list of all attempts made at direct die water cooling, in french but with pictures, here
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post #8 of 24 (permalink) Old 05-15-2016, 12:46 AM - Thread Starter
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interesting I found this article on jet impingement written in 2007! 50,000 nozzles bigeyedsmiley.png bound to cause issues with foreign particles
I am wondering why it never really took off as we are entering an age where liquid cooling is almost a necessity with modern CPUs





Quote:



Looking beyond the limits of air-cooling systems, IBM researchers are taking their concept of branched channel design even further and are developing a novel and promising approach for water-cooling. Called direct jet impingement, it squirts water onto the back of the chip and sucks it off again in a perfectly closed system using an array of up to 50 000 tiny nozzles and a complicated tree-like branched return architecture.



By developing a perfectly closed system, there is also no fear of coolant getting into the electronics on the chips. IBM said its team was able to enhance the cooling capabilities of the system by devising ways to apply it directly to the back of the chip and thereby avoiding the resistive thermal interfaces in between the cooling system and the silicon.

IBM has demonstrated cooling power densities of up to 370W per square centimeter with water as coolant. This is more than six times beyond the current limits of air-cooling techniques at about 75W per square centimeter, according to the researchers. Yet, the system uses much less energy for pumping than other cooling systems do.

Source

another article 2005

http://www.electronics-cooling.com/2005/08/high-powered-chip-cooling-air-and-beyond/

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post #9 of 24 (permalink) Old 05-15-2016, 01:02 AM - Thread Starter
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Originally Posted by Bap2703 View Post

Interesting, I've never see that one, I'll go search for it.
I am maintaining a list of all attempts made at direct die water cooling, in french but with pictures, here

I am just reading through it now using google chrome with translated to English

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post #10 of 24 (permalink) Old 05-15-2016, 01:31 AM
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The surface area is too small and it gets too hot. Resulting that it cannot transfer all it's heat quicly to the water I guess...

I also would add some cooling fins to it (create bigger surface area) and let the water flow through that.

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