Originally Posted by Tapper
My games tends to crash when i reach 46-48C. Memtest does not heat up the ram to anywhere close to that so i get no errors when testing the ram. Gaming heats up the ram way higher because both cpu and gpu heats up the case. I got plenty of Noctua fans so i dont see how i can improve the airflow any more.
About ram temperatures:
Assuming your memory is still this one (F4-3200C14D-16GFX) that you noted in another thread, the sticks should have some aluminum heatsinks that are more than adequate for the loads you are giving it with appropriate airflow. Trying to dismantle the heatsink may not be easy to do as an Amazon user review noted there was tough to remove thermal tape on the backside of the PCB
If you do successfully remove the memory heatsinks without ripping off any of the memory chips, you should see something like this (minus the sticker):
Those big black rectangles are DDR4 memory ICs that have a non-electrically conductive epoxy coating forming a package around the DDR4 silicon to protect it and have little solder balls underneath the IC connecting to the memory PCB for the electricity to pass through. Having bare metal touching this epoxy will not hurt the memory even if it is turned on (although heat transfer will be relatively bad without a thermal paste/pad), but anything electrically conductive touching the solder balls or the solder of any other component on the board will probably end up causing a short circuit. This is unlikely to impact you because the memory chips are usually the tallest thing on a memory PCB and the heatsinks usually have thermal tape or thermal pads preventing the heatsink from flexing and touching any PCB components; but short of using liquid metal for your custom heatsinks thermal interface, the risk for electrical shorts is pretty low.
The main advantage to using thermal paste over pads is the paste can be spread thinner under pressure and increase the effective heat transfer into your heatsink. Thermal pads/tape are a lot less messy though and are far more forgiving of mistakes during the mounting step due to their solid nature that limits their movement. You will also have to find a way to connect the two heatsink pieces together while maintaining even pressure across the memory chips to ensure your thermal interface doesn't have air gaps (much easier to do with thermal pads/tape than paste).
As for your memory temperatures, having a picture of your case and CPU/GPU arrangement would be useful because memory heatsinks tend to be overshadowed by the CPU heatsink and don't recieve a lot of direct airflow. Putting a thermometer probe in the space between your two memory sticks and comparing the reading to the air temperature in front of your CPU cooler (presumably behind an intake fan) can do a lot to tell you how much airflow your memory is actually getting. You can also test the temperature of the air inside and outside your case to determine if your case isn't being ventilated properly and then play around with your fan orientations.
Hope this helps! If you do decide to make custom copper heatsinks for your memory, please consider posting your build log here as I am sure people would love to see your design and results!