AORUS has unveiled its new flagship X499 motherboards for the next-generation Core X HEDT CPU lineup that is coming this fall.
The motherboards were shown during a VIP tour of the AORUS booth at Computex 2019 where the company had displayed a range of their new products, including the new X570 motherboards that we rounded up a few days ago. There were three very interesting motherboards shown during the event which were labeled as X299G but it was easy to note that these were placeholder names that were taped on the real names themselves. Underneath the taped product name, we were able to set our sights at the X499 naming scheme and this was also confirmed by a label on one of the top VRM heatsinks on the new Designare-10G.
I think the most interesting thing about this article is the "confirmation" of the name X499 (at least as a placeholder) per Gigabyte.
Last edited by SuprPwrUsr; 05-29-2019 at 08:37 AM.
So X299(G) became X499 just because? It's the same chipset, right?
Intel wants to differentiate it somehow? Don't think it's the same chipset, otherwise it wouldn't been X79 for both Sandy-E and Ivy-E. Then again given how many lakes Intel has put out, who the hell knows at this point.
- 4930K @ 4.5 GHz | Asus X79-Deluxe - MSi 980 Ti Gaming @ 1500/8000 - 4x4 GB Dominator Platinum 2400 MHz - 2x 850 Pro 2TB - Seasonic PRIME Titanium 850W - Phanteks Enthoo Primo - Custom watercooling (420+360+240) - XB270HU 27" 1440p 144Hz IPS
The leaked intel roadmaps seemed to say so as their next "Extreme" chip was just going to be a rebrand of last years.
Knowing intel though, they may lock down their newest chips and boards by moving 1 pin since they will have PCIE 4.0
Same Skylake-X chips just rebranded again with with better solder then the last rebrand of Skylake-X.
Leaked info is pointing towards PCI-E 4 being a PLX chip which converts it back to PCI-E 3 to the CPU. So might be some changes to the chipset.
And TDP is being raised 20W for each X chip (So im guessing more factory overclock to compete with the 12C AMD)