Will interesting to see Co-EMIB products, to see how they compare to EMIB and Foreveros products. EMIB products are already out in the wild with Foreveros products coming soon. The implementation is new but the method itself isn't. It's basically 3D stacking of components. First came 3D stacking of cores, components would simply be the next logical step. Definite advantages in CPU MCM designs. Shorter interconnects for one. Only possible issue I see is probably cooling when Intel scales this to the desktop, professional, enterprise level. Intel with MCM CPU designs for the desktop, professional, enterprise won't be out for several years. So they have time to refine the implementation.