Why should the FETs heat up significantly more due to the distance between them and the power plugs?
The traces and landings might get a little bit hotter but that shouldn't affect the VRM FETs a lot IMHO.
Edit: Btw, is anybody able to help me out with the different VCCs for TR4? Can't find any offical stuff from AMD about that.
But MSI is using a IR35201 again so most likely it'll be SVI2-based like AM4 with one CPU VCC and one SoC VCC. On lots of boards I do also see three more buck converter phases besides those under the large heatsink and the two DRAM converters (e.g. ASUS Zenith and MSI Gaming Pro Carbon). These could be the SoC phases. Or what do you guys think?