Direct Die and Dice cooling?

I have a question but first lets start with some of my dice background.

I've been making some runs on dice lately on the following platforms:

-Z77 with the i5-3570K on the ASRock Z77 Fatal1ty Professional-M
-Z87 with the G3258 on the ASRock Z87 OC Formula
-Z270 with the i5-6600K and the i7-7700K on the ASRock Z270 SuperCarrier

Since I have been running on dice with the Dragon F1 Extreme Dark LN2 pot from Kingpin Cooling, I have made some modifications to the pot itself and to the IHSes of my CPUs. Listed below are the mods I decided to do:

-I lapped the bottom of my LN2 pot.
-I delidded all of my CPUs
-I lapped the tops all of my IHSes
-I also scratched up the bottom of my IHSes to provide a little more surface area for the TIM to grab onto

I do believe all of these steps have let me push my CPUs just a little bit further than if I chose not do all of those steps. However, there was quite a bit of work involved.

So my question is:
Would it be better to run direct die with dice to save on prep time?

I understand all of the risks involved with running direct die with LN2 pots. However, if there was a way to find out the heights of the die of different CPUs. I would be comfortable trying some methods out on my G3258. So please feel free to take me to school. Lol It would be greatly appreciated!!!!!