Originally Posted by bigjdubb
Surely they don't mean directly at the surface of an IHS. So directly at the surface of what? I can't imagine it being anything other than a cold plate if they intend for the water it's spraying to be contained.
Pretty sure it sounds like they are intending to do direct-die jetting (whole new meaning to direct-die cooling
. There has to be a pressure level that can deliver the performance of 10x common passive techniques, but still safe enough to not chip at the die over continuous usage. If that is too dangerous and complicated with mating issues to the rest of the PCB, they can still apply a thin but robust shim/plate to the die to act as a buffer but still draw heat efficiently.