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post #1 of (permalink) Old 12-11-2019, 02:49 PM - Thread Starter
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[AnandTech] Intel’s Manufacturing Roadmap from 2019 to 2029: Back Porting, 7nm, 5nm, 3nm, 2nm, and 1.4 nm

Source: https://www.anandtech.com/show/15217...m-2019-to-2029

Quote:
So let’s go through some key areas.

1.4nm in 2029
Intel expects to be on 2 year cadence with its manufacturing process node technology, starting with 10nm in 2019 and moving to 7nm EUV in 2021, then a fundamental new node in each of 2023, 2025, 2027, 2029. This final node is what ASML has dubbed '1.4nm'. This is the first mention on 1.4nm in the context of Intel on any Intel-related slide. For context, if that 1.4nm is indicative of any actual feature, would be the equivalent of 12 silicon atoms across.

It is perhaps worth noting that some of the talks at this year’s IEDM features dimensions on the order of 0.3nm with what are called ‘2D self-assembly’ materials, so something this low isn’t unheard of, but it is unheard of in silicon. Obviously there are many issues going that small that Intel (and its partners) will have to overcome.

+, ++, and Back Porting
In between each process node, as Intel has stated before, there will be iterative + and ++ versions of each in order to extract performance from each process node. The only exception to this is 10nm, which is already on 10+, so we will see 10++ and 10+++ in 2020 and 2021 respectively. Intel believes they can do this on a yearly cadence, but also have overlapping teams to ensure that one full process node can overlap with another.


Update: After some emailing back and forth, we can confirm that the slide that Intel's partner ASML presented at the IEDM conference is actually an altered version of what Intel presented for the September 2019 source. ASML added animations to the slide such that the bottom row of dates correspond to specific nodes, however at the time we didn't spot these animations (neither did it seem did the rest of the press). It should be noted that the correlation that ASML made to exact node names isn't so much a stretch of the imagination to piece together, however it has been requested that we also add the original Intel slide to provide context to what Intel is saying compared to what was presented by ASML. Some of the wording in the article has changed to reflect this. Our analysis is still relevant.
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